MCIMX513DJM8CR2 Freescale Semiconductor, MCIMX513DJM8CR2 Datasheet - Page 39

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MCIMX513DJM8CR2

Manufacturer Part Number
MCIMX513DJM8CR2
Description
IC MPU I.MX51 529MABGA
Manufacturer
Freescale Semiconductor
Series
i.MX51r
Datasheet

Specifications of MCIMX513DJM8CR2

Core Processor
ARM Cortex-A8
Core Size
32-Bit
Speed
800MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.8 V ~ 1.15 V
Oscillator Type
External
Operating Temperature
-20°C ~ 85°C
Package / Case
529-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
4.5.4
The load circuit for output pads, the output pad transition time waveform and the output pad propagation
and transition time waveform are below.
Figure 10
Figure 11
AC electrical characteristics in DDR2 mode for fast mode and for ovdd = 1.65 – 1.95 V, ipp_hve = 0 are
placed in
Freescale Semiconductor
Output Pad Transition Times
Output Pad Propagation Delay, 50%-50%
Output Pad Slew Rate
Table
shows the output pad propagation and transition time waveform.
shows the output pad transition time waveform.
AC Electrical Characteristics for DDR2
Table 37. AC Electrical Characteristics of DDR2 IO Pads for Fast mode and
37.
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Parameter
Figure 11. Output Pad Propagation and Transition Time Waveform
1
1
Figure 10. Output Pad Transition Time Waveform
for ovdd=1.65 – 1.95 V (ipp_hve=0)
1
Symbol
tpo
tps
tpr
Condition
15pF
35pF
15pF
35pF
15pF
35pF
Test
0.57/0.57
1.29/1.29
0.98/0.96
1.47/1.50
2.05/2.05
0.91/0.91
rise/fall
Min
0.45/0.44
0.97/0.94
1.27/1.19
1.63/1.57
2.40/2.45
1.11/1.15
Typ
Electrical Characteristics
0.45/0.45
0.82/0.85
1.89/1.72
2.20/2.07
2.20/2.20
1.21/1.16
rise/fall
Max
Units
V/ns
ns
ns
39

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