MCIMX513DJM8CR2 Freescale Semiconductor, MCIMX513DJM8CR2 Datasheet - Page 21

• Manufacturer Part Number: MCIMX513DJM8CR2
• Description: IC MPU I.MX51 529MABGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX51r

Specifications of MCIMX513DJM8CR2

• Core Processor: ARM Cortex-A8
• Core Size: 32-Bit
• Speed: 800MHz
• Connectivity: 1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 128
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.8 V ~ 1.15 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 529-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

4
5
6
7
4.1.1
Table 15
Table 16
Freescale Semiconductor
1
2
JTAG: TCK Operating Frequency
Stop Mode
eFuse Program Current.
Current required to program one eFuse bit: The associated
VDD_FUSE supply per
CKIL: Operating Frequency
CKIH: Operating Frequency
XTAL Oscillator
• External reference clocks
• Power gating for ARM and
• Stop mode voltage
In Read mode, Freescale recommends VDD_FUSE be floated or grounded. Tying VDD_FUSE to a positive supply
(3.0 V–3.3 V) increases the possibility of inadvertently blowing fuses and is not recommended.
The NAND Flash supplies are composed of three groups: A, B, and C. Each group can be powered with a different supply
voltage. For example, NVCC_NANDF_A = 1.8 V, NVCC_NANDF_B = 3.0 V, NVCC_NANDF_C = 2.7 V.
The analog supplies should be isolated in the application design. Use of series inductors is recommended.
Operation of the HS-I
The read current of approximately 5 mA is derived from the DDR supply (NVCC_EMI_DRAM).
The current I
gated
processing units
Parameter Description
shows the fuse supply current.
shows the current core consumption (not including I/O) of the i.MX51.
Supply Current
Mode
program
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
is only required during program time.
2
C and I
Table
2
Table 16. i.MX51 Stop Mode Current and Power Consumption
Description
13.
2
C is not guaranteed when operated between the supply voltages of 1.95 to 2.7 V.
VDDGP = 0.85 V, VCC = 0.95 V, VDDA = 0.95 V
ARM CORE in SRPG mode
L1 and L2 caches power gated
IPU in S&RPG mode
VPU and GPU in PG mode
All PLLs off, all CCM-generated clocks off
CKIL input on with 32 kHz signal present
All modules disabled
USBPHY PLL off
External (MHz) crystal and on-chip oscillator
powered down (SBYOS bit asserted)
No external resistive loads that cause current flow
Standby voltage allowed (VSTBY bit is asserted)
T
A
= 25 °C
Symbol
f
Table 15. Fuse Supply Current
f
f
f
ckih
xtal
ckil
Table 14. Interface Frequency
tck
See
See
See
CKIH2)," on page 47
Condition
Table 47, "CAMP Electrical Parameters (CKIH1,
Table 99, "JTAG Timing," on page 129
Table 74, "FPM Specifications," on page 79
Min
22
Symbol
I
program
1
Min
—
NVCC_OSC
Max
VDDGP
27
Supply
VDDA
VCC
Total
Typ
60
Electrical Characteristics
Nominal
0.012
Max
120
0.18
0.35
0.15
0.66
MHz
MHz
MHz
Unit
kHz
Unit
Unit
mW
mA
mA
21