NTLUD3191PZTBG ON Semiconductor, NTLUD3191PZTBG Datasheet - Page 6

• Manufacturer Part Number: NTLUD3191PZTBG
• Description: MOSFET P-CH 20V 1.7A DUAL 6UDFN
• Manufacturer: ON Semiconductor

Specifications of NTLUD3191PZTBG

• Fet Type: 2 P-Channel (Dual)
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 250 mOhm @ 1.5A, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 1.1A
• Vgs(th) (max) @ Id: 1V @ 250µA
• Gate Charge (qg) @ Vgs: 3.5nc @ 4.5V
• Input Capacitance (ciss) @ Vds: 160pF @ 10V
• Power - Max: 500mW
• Mounting Type: Surface Mount
• Package / Case: 6-UDFN Exposed Pad
• Configuration: Dual
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 0.25 Ohm @ 4.5 V
• Forward Transconductance Gfs (max / Min): 1.4 S
• Drain-source Breakdown Voltage: 20 V
• Gate-source Breakdown Voltage: +/- 8 V
• Continuous Drain Current: 1.4 A
• Power Dissipation: 800 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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6X
REFERENCE
2X
DETAIL A
PIN ONE
0.10 C
2X
0.05 C
0.05 C
6X
6X
K
0.10 C
L
DETAIL B
e
BOTTOM VIEW
SIDE VIEW
TOP VIEW
É É
É É
6
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D1
D
3
4
A1
D2
2X
E1
A
E
(A3)
B
6X
b
0.10
0.05
A
C
C
C
SEATING
PLANE
NOTE 3
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
B
EXPOSED Cu
UDFN6 1.6x1.6, 0.5P
http://onsemi.com
CASE 517AT−01
A1
L1
ISSUE O
CONSTRUCTION
É É É
È È È
È È È
DETAIL A
CONSTRUCTION
OPTIONAL
DETAIL B
6
*For additional information on our Pb−Free strategy and soldering
OPTIONAL
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
0.50 PITCH
MOLD CMPD
0.48
6X
A3
MOUNTING FOOTPRINT*
SOLDERMASK DEFINED
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
1.34
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIMENSIONS: MILLIMETERS
DIM
A1
A3
D1
D2
E1
L1
A
D
K
b
E
e
L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
0.45
0.00
0.20
1.14
0.38
0.54
0.20
0.15
−−−
1.60 BSC
1.60 BSC
0.50 BSC
0.13 REF
0.58
0.74
MAX
0.55
0.05
0.30
1.34
0.58
0.74
0.35
0.10
0.32
2X
−−−
6X
1.90
NTLUD3191PZ/D