FSBB20CH60F Fairchild Semiconductor, FSBB20CH60F Datasheet

FSBB20CH60F

Manufacturer Part Number

FSBB20CH60F

Description

IC SMART POWER MOD 20A SPM27-CA

Manufacturer

Fairchild Semiconductor

Series

SPM™r

Type

IGBTr

Datasheet

1.FSBB20CH60F.pdf (16 pages)

Specifications of FSBB20CH60F

Configuration

3 Phase

Current

20A

Voltage

600V

Voltage - Isolation

2500Vrms

Package / Case

SPM27CA

Collector-emitter Saturation Voltage

2.3 V

Gate-emitter Leakage Current

250 uA

Power Dissipation

61 W

Mounting Style

SMD/SMT

Output Current

40A

Supply Voltage Range

13.5V To 16.5V

No. Of Pins

Termination Type

Screw

Supply Voltage Min

300V

Output Current Max

5mA

Frequency

20kHz

Power Supply Type

Power Module

Rohs Compliant

Yes

Filter Terminals

Screw

Output Voltage Max

4.5V

For Use With

FEB154 - BOARD EVAL FOR FSBB20CH60

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FSBB20CH60F

Manufacturer:

PANASONIC

Quantity:

2 020

Company:

H&T Electronics

Part Number:

FSBB20CH60F

Quantity:

2 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

FSBB20CH60F834

Manufacturer:

EUPEC/Infineon

Quantity:

1 000

Current page: 1 of 2
Download datasheet (41Kb)

This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

viewing upon request.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Sun, Brian

E-mail: Brian.Sun@fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2007/12/08

Earliest Year/Work Week of Changed Product: 0750

Change Type Description: Bond Wire Material Composition

Description of Change (From): Au wire bonding in SPM27CA/DA/EA/FA package

Description of Change (To): Copper wire bonding in SPM27CA/DA/EA/FA package

Reason for Change : Add alternative raw material with same quality standard to decrease

material shortage risk

Qual/REL Plan Numbers : Q20070092

Qualification :

Passed and meet the FSC rel performance requirement

Change From

Change To

Results/Discussion

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

Technical Contact:

Name: Zhu, Adams

E-mail: Adams.Zhu@notes.fairchildsemi.com

Phone:

Date Issued On : 2007/04/06

Date Created : 2007/03/13

PCN# : Q1071103

Pg. 1

Related parts for FSBB20CH60F

FSBB20CH60F Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

... Product Id Description : Affected FSIDs : FCAS50SN60 FPDB20PH60 FSAB20PH60 FSBB20CH60 96-HOURS 0/20 168-HOURS 500-HOURS 0/20 0/20 168-HOURS 500-HOURS 0/20 0/20 100-CYCLES 200-CYCLES 0/20 0/20 FPAB30PH60 FPDB30PH60 FSBB15CH60 FSBB20CH60F Failure Code 1000-HOURS Failure Code 0/20 1000-HOURS Failure Code 0/20 Failure Code FPAB50PH60 FPDB50PH60 FSBB15CH60F FSBB30CH60 Pg. 2 ...

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