RMPA1765 Fairchild Semiconductor, RMPA1765 Datasheet
RMPA1765
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RMPA1765 Summary of contents
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... Vref ©2005 Fairchild Semiconductor Corporation RMPA1765 Rev. C General Description The RMPA1765 power amplifier module (PAM) is designed for Korean CDMA, CDMA2000-1X and WCDMA personal commu- nications system (PCS) applications. The 2 stage PAM is inter- nally matched to 50 Ohms to minimize the use of external components and features a low-power mode to reduce standby current and DC power consumption during peak phone usage ...
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... Quiescent Current Reference Current Shutdown Leakage Current Notes: 1. All parameters met +25°C, Vcc = +3.4V, Vref = 2.85V 1750 MHz and load VSWR ≤ 1.2:1, unless otherwise noted. 2. All phase angles. 3. Guaranteed by design. RMPA1765 Rev. C Symbol Vcc1, Vcc2 Vref Vmode Pin Tstg 1 Symbol Min ...
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... PAM Vcc=3.4V, Vref = 2.85V, Vmode=0V, Pout=28dBm -50.0 -52.0 -54.0 -56.0 -58.0 -60.0 -62.0 -64.0 -66.0 -68.0 -70.0 1760 1780 1720 3 2 RMPA1765 K-PCS 3x3mm PAM 1740 1760 1780 Frequency (MHz) 2 RMPA1765 K-PCS 3x3mm PAM 1740 1760 1780 Frequency (MHz) www.fairchildsemi.com ...
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... Linear Output Power (high-power) (low-power) Case Operating Temperature DC Turn-On Sequence 1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16 dBm) Low-Power: Vmode = 2V (Pout < 16 dBm) RMPA1765 Rev. C Symbol Min Typical f 1720 Vcc1, Vcc2 3.0 3.4 Vref 2.7 2 ...
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... ECJ-1VB1C104K A/R 8 SN63 A/R 9 SN96 Evaluation Board Schematic 3.3 µ Vcc1 SMA1 RF IN Vmode 1000 pF RMPA1765 Rev XYTT 1765 Part Number Description PC Board SMA Connector Terminals Assembly, RMPA1765 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3µF Capacitor (1206) 0.1µF Capacitor (0603) 0.1µ ...
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... SEE DETAIL A 1.00mm Signal Descriptions Pin # Signal Name 1 Vcc1 Vmode 4 Vref 5 GND 6 GND 7 RF Out 8 Vcc2 RMPA1765 Rev. C TOP VIEW XYTT 6 1765 5 FRONT VIEW 5 6 2.60mm 1.00mm 0.20mm BOTTOM VIEW Description Supply Voltage to Input Stage Reference Voltage RF Input Signal High-Power/Low-Power Mode Control ...
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... RMPA1765 Rev. C Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. • Reflow Profile – Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A typical heating rate is 1- 2° ...
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... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete RMPA1765 Rev. C IntelliMAX™ POP™ ISOPLANAR™ Power247™ PowerEdge™ LittleFET™ PowerSaver™ MICROCOUPLER™ PowerTrench MicroFET™ ...