RMPA0967 Fairchild Semiconductor, RMPA0967 Datasheet
RMPA0967
Specifications of RMPA0967
Related parts for RMPA0967
RMPA0967 Summary of contents
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... Vcc1 ©2006 Fairchild Semiconductor Corporation RMPA0967 Rev. G General Description The RMPA0967 power amplifier module (PAM) is designed for cellular band AMPS, CDMA, CDMA2000-1X, WCDMA and HSDPA applications. The 2 stage PAM is internally matched to 50 Ohms to minimize the use of external components and fea- tures a low-power mode to reduce standby current and DC power consumption during peak phone usage ...
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... Quiescent Current Reference Current Shutdown Leakage Current Notes: 1. All parameters met +25°C, Vcc = +3.4V, Freq = 836.5MHz, Vref = 2.85V and load VSWR O 1.2:1, unless otherwise noted. 2. All phase angles. 3. Guaranteed by design. RMPA0967 Rev. G Symbol Vcc1, Vcc2 Vref Vmode Pin Tstg 1 Symbol Min ...
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... RMPA0967 Cellular 3x3mm 2 PAM Vcc=3.4 V, Vref=2.85V, Vmode=0V, Pout=28 dBm, IS-95 Mod -40 -42 -44 -46 -48 -50 -52 -54 -56 -58 -60 824 836.5 849 Frequency (MHz) RMPA0967 Cellular 3x3mm 2 PAM Vcc=3.4 V, Vref=2.85V, Vmode=0V, Pout=28 dBm, IS-95 Mod -50 -52 -54 -56 -58 -60 -62 -64 -66 -68 -70 849 824 836.5 Frequency (MHz) ...
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... Linear Output Power (high-power) (low-power) Case Operating Temperature DC Turn On Sequence 1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16 dBm) Low-Power: Vmode = 2.0V (Pout < 16 dBm) RMPA0967 Rev. G Symbol Min Typical f 824 Vcc1, Vcc2 3.0 3.4 Vref 2.7 2 ...
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... SN63 A/R 100 SN96 Evaluation Board Schematic Vref 1000 pF Vmode SMA1 Ohm TRL Vcc1 3.3 RMPA0967 Rev DESCRIPTION PC, BOARD SMA CONNECTOR TERMINALS ASSEMBLY, RMPA0967 1000pF CAPACITOR (0603) 1000pF CAPACITOR (0603) 3.3µF CAPACITOR (1206) 0.1µF CAPACITOR (0603) 0.1µF CAPACITOR (0603) ...
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... SEE DETAIL A 0.80mm Signal Descriptions Pin # Signal Name 1 Vref 2 Vmode Vcc1 5 Vcc2 6 GND 7 RF Out 8 GND RMPA0967 Rev. G TOP VIEW FRONT VIEW 5 6 2.65mm 1.40mm 0.175mm BOTTOM VIEW Description Reference Voltage High-Power/Low-Power Mode Control RF Input Signal Supply Voltage to Input Stage Supply Voltage to Output Stage ...
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... RMPA0967 Rev. G Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. • Reflow Profile – Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A typical heating rate is 1- 2° ...
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... Advance Information Preliminary No Identification Needed Obsolete RMPA0967 Rev. G PowerSaver™ ISOPLANAR™ LittleFET™ PowerTrench MICROCOUPLER™ QFET QS™ MicroFET™ ...