RMPA1965 Fairchild Semiconductor, RMPA1965 Datasheet
RMPA1965
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... Vref ©2005 Fairchild Semiconductor Corporation RMPA1965 Rev. H General Description The RMPA1965 power amplifier module (PAM) is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal commu- nications system (PCS) applications. The 2 stage PAM is inter- nally matched to 50 Ω to minimize the use of external components and features a low-power mode to reduce standby current and DC power consumption during peak phone usage ...
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... Case Operating Temperature DC Characteristics Iccq Quiescent Current Iref Reference Current Icc(off) Shutdown Leakage Current Notes: 1. All parameters met +25°C, Vcc = +3.4V, Vref = 2.85V 1880MHz and load VSWR noted. 2. All phase angles. 3. Guaranteed by design. RMPA1965 Rev. H Parameter 1 Min Typ Max 1850 1910 ...
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... FREQUENCY (MHz) RMPA1965 ACPR1 vs. Frequency Pout = 28dBm, Vcc = 3.4V, Vref = 2.85V, Vmode = 0V -44 -46 -48 -50 -52 -54 -56 1850 1880 FREQUENCY (MHz) RMPA1965 Rev. H RMPA1965 PAE vs. Frequency Pout = 28dBm, Vcc = 3.4V, Vref = 2.85V, Vmode = 1850 1910 RMPA1965 ACPR2 vs. Frequency Pout = 28dBm, Vcc = 3.4V, Vref = 2.85V, Vmode = 0V ...
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... Pout Linear Output Power (High-Power) (Low-Power) Tc Case Operating Temperature DC Turn-On Sequence 1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16 dBm) Low-Power: Vmode = 2V (Pout < 16 dBm) RMPA1965 Rev. H Min Typ Max 1850 1910 3.0 3.4 4.2 2.7 2.85 3 ...
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... SN63 A/R 9 SN96 Evaluation Board Schematic 3.3 µF Vcc1 SMA1 RF IN Vmode 1000 pF RMPA1965 Rev. H Part Number Description PC Board SMA Connector Terminals Assembly, RMPA1965 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3µF Capacitor (1206) 0.1µF Capacitor (0603) 0.1µF Capacitor (0603) ...
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... SEE DETAIL A 1.00mm Signal Descriptions Pin No. Symbol 1 Vcc1 Vmode 4 Vref 5 GND 6 GND 7 RF Out 8 Vcc2 RMPA1965 Rev. H TOP VIEW FRONT VIEW 5 6 2.60mm 1.00mm 0.20mm BOTTOM VIEW Description Supply Voltage to Input Stage RF Input Signal High-Power/Low-Power Mode Control Reference Voltage Ground Ground ...
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... RMPA1965 Rev. H • If the 7-day period or the environmental conditions have been exceeded, then the dry-bake procedure must be repeated. Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. Reflow Profile • Ramp-up: During this stage the solvents are evaporated from the solder paste ...
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... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete RMPA1965 Rev. H POP™ IntelliMAX™ Power247™ ISOPLANAR™ PowerEdge™ LittleFET™ MICROCOUPLER™ PowerSaver™ MicroFET™ ...