RMPA0965 Fairchild Semiconductor, RMPA0965 Datasheet - Page 7

• Manufacturer Part Number: RMPA0965
• Description: IC MOD RF POWER AMP 8PIN 3X3LCC
• Manufacturer: Fairchild Semiconductor
• Type: Power Amplifierr

Specifications of RMPA0965

• Current - Supply: 60mA
• Frequency: 824MHz ~ 849MHz
• Gain: 30dB
• Noise Figure: 4dB
• Package / Case: 8-LCC
• Rf Type: Cellular, CDMA, CDMA2000, AMPS, IS-95, HSDPA
• Voltage - Supply: 3V ~ 4.2V
• Number Of Channels: 1
• Frequency (max): 849MHz
• Output Power: 28dBm
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3V
• Single Supply Voltage (typ): 3.4V
• Single Supply Voltage (max): 4.2V
• Package Type: PLCC
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temperature Classification: Commercial
• Operating Temp Range: -30C to 85C
• Pin Count: 9
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant
• Other names: RMPA0965TR

RMPA0965 Rev. F
Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE
Precautions to Avoid Permanent Device Damage:
• Cleanliness: Observe proper handling procedures to ensure
• Device Cleaning: Standard board cleaning techniques should
• Static Sensitivity: Follow ESD precautions to protect against
• General Handling: Handle the package on the top with a
• Device Storage: Devices are supplied in heat-sealed,
Device RF:
Fairchild RF recommends the following procedures prior to
assembly.
• Dry-bake devices at 125°C for 24 hours minimum. Note: The
• Assemble the dry-baked devices within 7 days of removal
• During the 7-day period, the devices must be stored in an
• If the 7-day period or the environmental conditions have been
clean devices and PCBs. Devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
not present device problems provided that the boards are
properly dried to remove solvents or water residues.
ESD damage:
– A properly grounded static-dissipative surface on which to
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each person
vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts
on the package bottom. Do not apply excessive pressure to
the top of the lid.
moisture-barrier bags. In this condition, devices are protected
and require no special storage conditions. Once the sealed
bag has been opened, devices should be stored in a dry
nitrogen environment.
shipping trays cannot withstand 125°C baking temperature.
from the oven.
environment of less than 60% relative humidity and a
maximum temperature of 30°C
exceeded, then the dry-bake procedure must be repeated.
place devices.
to wear while handling devices.
DEG (°C)
240
220
200
180
160
140
120
100
80
60
40
20
0
0
Figure 1. Recommended Solder Reflow Profile
1°C/SEC
183°C
60
120
SOAK AT 150°C
FOR 60 SEC
7
TIME (SEC)
Solder Materials & Temperature Profile: Reflow soldering is
the preferred method of SMT attachment. Hand soldering is not
recommended.
• Reflow Profile
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-free
attachment of the heatsink to the PWB. The solder joint should
be 95% void-free and be a consistent thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow of the
solder with a heat gun. The device should not be subjected to
more than 225°C and reflow solder in the molten state for more
than 5 seconds. No more than 2 rework operations should be
performed.
– Ramp-up: During this stage the solvents are evaporated
– Pre-heat/soak: The soak temperature stage serves two
– Reflow Zone: If the temperature is too high, then devices
– Cooling Zone: Steep thermal gradients may give rise to
from the solder paste. Care should be taken to prevent
rapid oxidation (or paste slump) and solder bursts caused
by violent solvent out-gassing. A typical heating rate is 1-
2°C/sec.
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 120-150 seconds at 150°C.
may be damaged by mechanical stress due to thermal
mismatch or there may be problems due to excessive
solder oxidation. Excessive time at temperature can
enhance the formation of inter-metallic compounds at the
lead/board interface and may lead to early mechanical
failure of the joint. Reflow must occur prior to the flux being
completely driven off. The duration of peak reflow
temperature should not exceed 10 seconds. Maximum
soldering temperatures should be in the range 215-220°C,
with a maximum limit of 225°C.
excessive thermal shock. However, rapid cooling promotes
a finer grain structure and a more crack-resistant solder
joint. The illustration below indicates the recommended
soldering profile.
180
45 SEC (MAX)
ABOVE 183°C
240
10 SEC
1°C/SEC
300
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