KA78RM33 Fairchild Semiconductor, KA78RM33 Datasheet
KA78RM33
Manufacturer Part Number
KA78RM33
Description
IC REG LDO 0.5A 3.3V TO-220
Manufacturer
Fairchild Semiconductor
Datasheet
1.KA78RM33RTM.pdf
(6 pages)
Specifications of KA78RM33
Regulator Topology
Positive Fixed
Voltage - Output
3.3V
Voltage - Input
Up to 20V
Number Of Regulators
1
Current - Output
500mA (Max)
Operating Temperature
-25°C ~ 125°C
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Dropout (typical)
-
Current - Limit (min)
-
Available stocks
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KA78RM33
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FSC
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15 182
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KA78RM33
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FAIRCHILD
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KA78RM33RTM
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POWER
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41 600
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KA78RM33RTM
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FAIRCHILD
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KA78RM33RTM
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Fairchild Semiconductor
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72 400
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FAIRCHILD/仙童
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20 000
Part Number:
KA78RM33TU
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Sun, Brian
E-mail: Brian.Sun@fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2007/11/24
Earliest Year/Work Week of Changed Product: 0747
Change Type Description: Bond Wire Material Composition, Lead Frame Dimensions (Internal
and External)
Description of Change (From): Thicker heatsink and die attach pad. Material composition for
wire used during wire bonding process is gold wire and copper.
Description of Change (To): Thinner heatsink and die attach pad (there is no change in heatsink
and die attach pad material). Material composition for wire used during wire bonding process
will be copper.
Reason for Change : Meet additional demand for various products in TO-220 package to
improve our service to customers.
Qual/REL Plan Numbers : Q20070208
Qualification :
Designed to qualify TO220 package using thinner heatsink and copper wire bonding
material Qualification Stress Test and Sample Size Detail
Change From
Technical Contact:
Name: LEE, SANGDO
E-mail: SANGDO.LEE@fairchildsemi.com
Phone: 86-512-6762-3311 ext 8671
FORECAST CHANGE NOTIFICATION
Date Issued On : 2007/10/09
Date Created : 2007/09/17
PCN# : Q3073801
Pg. 1
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KA78RM33 Summary of contents
Page 1
... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...
Page 2
Change To Pg. 2 ...
Page 3
Qualification Stress Test and Sample Size Detail Device #1 FJP5027RTU_F080 Package: -1 #Leads: -1 Environment Stress Detail: Stress P/C Standard ACLV JESD22-A102 100%RH, 121C 96 HTRB JESD22-A108 150C, 80%BVV 168 THBT JESD22-A101 85%RH, 85C, TMCL1 JESD22-A104 -65C, 150C Device #2 ...
Page 4
TMCL1 JESD22-A104 -65C, 150C Device #3 KSE13003TH2ATU Package: #Leads: Environment Stress Detail: Stress P/C Standard ACLV JESD22-A102 100%RH, 121C 96 HTRB JESD22-A108 150C, 80%BVV 168 HTSL JESD22-A103 150C THBT JESD22-A101 85%RH, 85C, TMCL1 JESD22-A104 -65C, 150C Device #4 KSE13009TU Package: ...
Page 5
... MC7805AECT MC7806ECT MC7810ECT MC7815AECT MC7818ECT MC78M05CT MC78M12CT MC78T05CT MC78T12CT_NL MC7905CT MC7912CT MC7915CT KA7812ETSTU KA7815AETU KA7815ETU KA7818ETSTU KA7824AETU KA7824ETU KA78M06TU KA78M15TU KA78RM33TSTU KA78T05TU KA78T15TU KA7906TU KA7910TU_NL KA7912TU KA7915TU KA7924TU KA79M12TU KSA473O KSA473Y KSA473YTU KSC1173YTSTU KSC1173YTU_F080 LM317MT LM337T LM7805ACT LM7806ACT LM7808CT LM7810ACT LM7812CT ...