MPC5553MZQ132 Freescale Semiconductor, MPC5553MZQ132 Datasheet - Page 9

• Manufacturer Part Number: MPC5553MZQ132
• Description: IC MCU MPC5553 REV A 324-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC55xx Qorivvar

Specifications of MPC5553MZQ132

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 220
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC5xxx
• Core: e200z6
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: 7-Wire, DSPI, ESCI
• Maximum Clock Frequency: 132 MHz
• Number Of Timers: 56
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• For Use With: MPC5553EVBISYS - KIT EVAL ISYSTEMS MPC5553MPC5553EVBGHS - KIT EVAL GREEN HILLS SOFTWAREMPC5553EVB - KIT EVAL MPC5553MZP132MPC5553EVBE - BOARD EVAL FOR MPC5553
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

3.3
The MPC5553 is available in packaged form. Read the package options in
Information.”
3.4
1
2
3
3.5
1
2
Freescale Semiconductor
ESD for human body model (HBM)
HBM circuit description
ESD for field induced charge model (FDCM)
Number of pulses per pin:
Interval of pulses
Spec
EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Measured with the single-chip EMI program.
Measured with the expanded EMI program.
All ESD testing conforms to CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.
Device failure is defined as: ‘If after exposure to ESD pulses, the device does not meet the device specification requirements,
which includes the complete DC parametric and functional testing at room temperature and hot temperature.
1
2
3
4
5
6
7
Positive pulses (HBM)
Negative pulses (HBM)
Scan range
Operating frequency
V
V
V
Maximum amplitude
Operating temperature
DD
DDSYN
PP
, V
Package
EMI (Electromagnetic Interference) Characteristics
ESD (Electromagnetic Static Discharge) Characteristics
operating voltages
DDEH
, V
Refer to
RC33
, V
DDA
, V
Characteristic
DD33
operating voltages
Section 4, “Mechanicals,”
Characteristic
, V
FLASH
, V
MPC5553 Microcontroller Data Sheet, Rev. 3.0
Table 4. EMI Testing Specifications
DDE
operating voltages
Table 5. ESD Ratings
for pinouts and package drawings.
Symbol
Minimum
R1
—
—
—
C
0.15
—
—
—
—
—
—
1, 2
750 (corner pins)
1
500 (all pins)
Typical
Value
1.5
3.3
5.0
2000
1500
—
—
—
—
Section 2, “Ordering
100
1
1
1
Electrical Characteristics
Maximum
1000
f
14
32
MAX
—
—
25
—
2
3
second
Unit
pF
—
—
V
Ω
V
dBuV
MHz
MHz
Unit
o
V
V
V
C
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