MPC5553MZQ132 Freescale Semiconductor, MPC5553MZQ132 Datasheet - Page 6

• Manufacturer Part Number: MPC5553MZQ132
• Description: IC MCU MPC5553 REV A 324-PBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC55xx Qorivvar

Specifications of MPC5553MZQ132

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 220
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC5xxx
• Core: e200z6
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: 7-Wire, DSPI, ESCI
• Maximum Clock Frequency: 132 MHz
• Number Of Timers: 56
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• For Use With: MPC5553EVBISYS - KIT EVAL ISYSTEMS MPC5553MPC5553EVBGHS - KIT EVAL GREEN HILLS SOFTWAREMPC5553EVB - KIT EVAL MPC5553MZP132MPC5553EVBE - BOARD EVAL FOR MPC5553
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

Electrical Characteristics
3.2
The shaded rows in the following table indicate information specific to a four-layer board.
3.2.1
An estimation of the device junction temperature, T
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
1
2
3
4
5
6
6
Spec
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
1
2
3
4
5
6
7
•
•
Construction of the application board (number of planes)
Effective size of the board which cools the component
Junction to ambient, natural convection (one-layer board)
Junction to ambient, natural convection
(four-layer board 2s2p)
Junction to ambient (@200 ft./min., one-layer board)
Junction to ambient (@200 ft./min., four-layer board 2s2p)
Junction to board (four-layer board 2s2p)
Junction to case
Junction to package top, natural convection
Thermal Characteristics
where:
General Notes for Specifications at Maximum Junction Temperature
T
T
R
P
A
D
J
θJA
= T
= ambient temperature for the package (
= power dissipation in the package (W)
= junction to ambient thermal resistance (
MPC5553 Thermal Characteristic
A
5
+ (R
θJA
× P
Table 3. MPC5553 Thermal Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 3.0
D
)
1, 3
4
6
J
, can be obtained from the equation:
1, 2
o
C)
o
C/W)
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
MAPBGA
208
41
25
33
22
15
7
2
Packages
PBGA
324
30
21
24
17
12
Freescale Semiconductor
8
2
PBGA
416
29
21
23
18
13
9
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit