MC68HC908JB16JDW Freescale Semiconductor, MC68HC908JB16JDW Datasheet - Page 326
![IC MCU 16K FLASH 6MHZ USB 20SOIC](/photos/6/50/65027/375-20-soic_sml.jpg)
MC68HC908JB16JDW
Manufacturer Part Number
MC68HC908JB16JDW
Description
IC MCU 16K FLASH 6MHZ USB 20SOIC
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet
1.MC908JB16DWE.pdf
(332 pages)
Specifications of MC68HC908JB16JDW
Core Processor
HC08
Core Size
8-Bit
Speed
6MHz
Connectivity
SCI, USB
Peripherals
LED, LVD, POR, PWM
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC908JB16JDWE
Manufacturer:
FREESCALE
Quantity:
20 000
- Current page: 326 of 332
- Download datasheet (4Mb)
Mechanical Specifications
21.3 32-Pin Low-Profile Quad Flat Pack (LQFP)
Technical Data
326
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
Figure 21-1. 32-Pin LQFP (Case #873A)
X
–Z–
25
K
R
4X
4X
17
Q
Mechanical Specifications
0.20 (0.008)
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É
É É
É É
É É
T–U
METAL
BASE
Z
N
J
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
MC68HC908JB16
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
DETAIL Y
1
12 REF
Freescale Semiconductor
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
12 REF
1
INCHES
AE
AE
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
MAX
0.010
5
—
Rev. 1.1
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