STR911FM42X6 STMicroelectronics, STR911FM42X6 Datasheet - Page 54
STR911FM42X6
Manufacturer Part Number
STR911FM42X6
Description
MCU 256K FLASH 96K SRA, USB CAM
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet
1.STR910FM32X6.pdf
(73 pages)
Specifications of STR911FM42X6
Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, I²C, Microwire, SPI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-5060
497-5060-2
497-5060-2
STR911FM42X6T
497-5060-2
497-5060-2
STR911FM42X6T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Electrical characteristics
6.11
6.11.1 Functional EMS (Electro Magnetic Susceptibility)
6.11.2 Electro Magnetic Interference (EMI)
Notes:
1. Data based on characterization results, not tested in production.
2. BGA and LQFP devices have similar EMI characteristics.
54/73
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events until a failure occurs (indicated by the
LEDs).
●
●
A device reset allows normal operations to be resumed.
Table 17.
1. Data based on characterization results, not tested in production.
Based on a simple application running on the product (toggling 2 LEDs through the I/O ports),
the product is monitored in terms of emission. This emission test is in line with the norm SAE J
1752/3 which specifies the board and the loading of each pin.
Table 18.
Symbol
Symbol
V
V
FESD
S
FFTB
EMI
ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
with the IEC 1000-4-4 standard.
SS
through a 100pF capacitor, until a functional disturbance occurs. This test conforms
Voltage limits to be applied on
any I/O pin to induce a functional
disturbance
Fast transient voltage burst limits
to be applied through 100pF on
V
functional disturbance
DD
Peak level
EMS data
EMI data
Parameter
and V
DDQ
Parameter
pins to induce a
V
T
LQFP128 package
conforming to SAE J
1752/3
A
DDQ
=+25°C,
=3.3V, V
Conditions
DD
V
T
MHz/96MHz PLL
V
T
MHz/96 MHz PLL
conforms to IEC 1000-4-4
=1.8V,
A
A
DD
DD
=+25°C, f
=+25°C, f
=1.8V, V
=1.8V, V
0.1MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1GHz
SAE EMI Level
Frequency Band
Conditions
OSC
OSC
DDQ
DDQ
Monitored
/f
/f
=3.3V,
=3.3V,
CPUCLK
CPUCLK
=4
=4
4 MHz/ 96 MHz
[f
OSC
Neg.
-1
-4
Max vs.
(1)
(1)
/f
10
10
22
CPUCLK
4
DD,
Pos.
>2
4
(1)
(1)
STR91xF
V
]
DDQ
Unit
dBµV
Unit
kV
and
-