DSPIC30F6011T-20I/PF Microchip Technology, DSPIC30F6011T-20I/PF Datasheet - Page 225
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DSPIC30F6011T-20I/PF
Manufacturer Part Number
DSPIC30F6011T-20I/PF
Description
IC DSPIC MCU/DSP 132K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F5011T-20IPT.pdf
(34 pages)
3.DSPIC30F6010T-20IPF.pdf
(6 pages)
4.DSPIC30F6011T-20IPF.pdf
(12 pages)
5.DSPIC30F6011T-20IPF.pdf
(226 pages)
Specifications of DSPIC30F6011T-20I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
For Use With
XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F6011T20IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6011T-20I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F5011T-20IPT PDF datasheet #2
- DSPIC30F6010T-20IPF PDF datasheet #3
- DSPIC30F6011T-20IPF PDF datasheet #4
- DSPIC30F6011T-20IPF PDF datasheet #5
- Current page: 225 of 226
- Download datasheet (6Mb)
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
2004 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F6011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 6 0 11 AT- 3 0 I / P F - E S
dsPIC30F6011/6012/6013/6014
Preliminary
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
PF = TQFP 14x14
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70117E-page 223
Speed
20 = 20 MIPS
30 = 30 MIPS
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