DSPIC30F6011T-20I/PF Microchip Technology, DSPIC30F6011T-20I/PF Datasheet - Page 174
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F6011T-20I/PF
Manufacturer Part Number
DSPIC30F6011T-20I/PF
Description
IC DSPIC MCU/DSP 132K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F5011T-20IPT.pdf
(34 pages)
3.DSPIC30F6010T-20IPF.pdf
(6 pages)
4.DSPIC30F6011T-20IPF.pdf
(12 pages)
5.DSPIC30F6011T-20IPF.pdf
(226 pages)
Specifications of DSPIC30F6011T-20I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
For Use With
XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F6011T20IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6011T-20I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F5011T-20IPT PDF datasheet #2
- DSPIC30F6010T-20IPF PDF datasheet #3
- DSPIC30F6011T-20IPF PDF datasheet #4
- DSPIC30F6011T-20IPF PDF datasheet #5
- Current page: 174 of 226
- Download datasheet (6Mb)
dsPIC30F6011/6012/6013/6014
TABLE 23-2:
TABLE 23-3:
TABLE 23-4:
DS70117E-page 172
dsPIC30F601x-30I
dsPIC30F601x-20I
dsPIC30F601x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
V
V
V
V
S
I
Symbol
/
Junction to ambient thermal resistance, Theta-ja (
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
INT
O
DD
DD
DR
POR
VDD
=
=
∑
V
(
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
{
D D
V
(2)
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
DD
×
DD
DD
(
–
I
D D
Start Voltage
Rise Rate
V
Characteristic
O H
–
∑
}
Rating
Characteristic
×
I
O H
I
OH
)
)
DD
+
∑
can be lowered without losing RAM data.
(
V
OL
×
I
O L
Preliminary
(3)
)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
0.05
Min
2.5
3.0
—
—
θ
JA
) numbers are achieved by package simulations.
Typ
V
1.5
—
—
SS
Symbol
Symbol
P
(1)
DMAX
θ
θ
P
T
T
T
T
T
T
A
A
A
JA
JA
D
J
J
J
Max
5.5
5.5
—
—
Min
Typ
-40
-40
-40
-40
-40
-40
-40°C ≤ T
-40°C ≤ T
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
2004 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
Max
Typ
A
A
50
50
+ P
A
≤ +85°C for Industrial
≤ +125°C for Extended
) /
I
θ
/
O
Conditions
JA
°C/W
°C/W
+125
+150
+150
+125
Max
Unit
+85
+85
Notes
Unit
°C
°C
°C
°C
°C
°C
W
W
1
1
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