SAK-TC1197-512F180E AC Infineon Technologies, SAK-TC1197-512F180E AC Datasheet - Page 176

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SAK-TC1197-512F180E AC

Manufacturer Part Number
SAK-TC1197-512F180E AC
Description
IC MCU 32BIT 4MB FLASH BGA416-10
Manufacturer
Infineon Technologies
Series
TC11xxr
Datasheet

Specifications of SAK-TC1197-512F180E AC

Core Processor
TriCore
Core Size
32-Bit
Speed
180MHz
Connectivity
ASC, CAN, EBI/EMI, MLI, MSC, SSC
Peripherals
DMA, POR, WDT
Number Of I /o
219
Program Memory Size
4MB (4M x 8)
Program Memory Type
FLASH
Ram Size
224K x 8
Voltage - Supply (vcc/vdd)
1.42 V ~ 1.58 V
Data Converters
A/D 48x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
416-BGA
Packages
PG-BGA-416
Max Clock Frequency
180.0 MHz
Sram (incl. Cache)
224.0 KByte
Can Nodes
4
A / D Input Lines (incl. Fadc)
48
Program Memory
4.0 MB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
5.3.10.2 Micro Second Channel (MSC) Interface Timing
Table 29
Parameter
FCLP clock period
SOP/ENx outputs delay
from FCLP rising edge
SDI bit time
SDI rise time
SDI fall time
1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times.
2) FCLP signal high and low can be minimum 1 ×
3)
Figure 40
Note: The data at SOP should be sampled with the falling edge of FCLP in the target
Data Sheet
T
MSCmin
device.
FCLP
SOP
EN
SDI
=
T
SYS
MSC Interface Timing (Operating Conditions apply), C
MSC Interface Timing
= 1 /
f
1)2)
SYS
. When
t
45
f
SYS
Symbol
t
t
t
t
t
40
45
46
48
49
= 90 MHz,
t
46
CC 2 ×
CC -10
CC 8 ×
SR
SR
t
40
t
T
40
Min.
MSC
= 22,2ns
172
.
T
T
t
48
MSC
MSC
3)
Values
t
45
t
Typ.
46
10
Max.
100
100
t
Electrical Parameters
49
MSC_Tmg_1.vsd
Unit
ns
ns
ns
ns
ns
L
0.9
0.1
= 50 pF
0.9
0.1
V
V
V
V
V1.1, 2009-05
DDP
DDP
DDP
DDP
Note /
Test Con
dition
TC1197

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