UPD70F3745GJ-GAE-AX Renesas Electronics America, UPD70F3745GJ-GAE-AX Datasheet - Page 824

• Manufacturer Part Number: UPD70F3745GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3r

Specifications of UPD70F3745GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 128
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 60K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JJ3
(b) CLKOUT synchronous
(T
Remark The values in the above specifications are values for when clocks with a 1:1 duty ratio are input from X1.
Bus Hold (CLKOUT Synchronous)
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
A
HLDRQ setup time (to CLKOUT↓)
HLDRQ hold time (from CLKOUT↓)
Delay time from CLKOUT↑ to bus float
Delay time from CLKOUT↑ to HLDAK
= −40 to +85°C, V
Address bus (output)
CS0 to CS3 (output)
WR0, WR1 (output)
CLKOUT (output)
HLDAK (output)
HLDRQ (input)
ASTB (output)
Data bus (I/O)
RD (output),
Parameter
DD
= EV
<83>
DD
T2
= AV
<84>
REF0
T3
= AV
t
t
t
t
SHQK
HKHQ
DKF
DKHA
REF1
Symbol
, V
TI
<85>
SS
= EV
<83>
<84>
<85>
<86>
<86>
CHAPTER
SS
TH
= AV
SS
Conditions
= 0 V, C
TH
29
Hi-Z
Hi-Z
Hi-Z
Hi-Z
L
<83>
= 50 pF)
ELECTRICAL
TH
MIN.
20
5
<86>
TI
MAX.
SPECIFICATIONS
19
19
Page 808 of 892
Unit
ns
ns
ns
ns