DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 947

• Manufacturer Part Number: DF2377RVFQ33W
• Description: IC H8S MCU FLASH 3V 384K 144LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2377RVFQ33W

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 97
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Flash Memory (0.18-μm F-ZTAT Version)
21.3.2
Programming/Erasing Interface Parameter
The programming/erasing interface parameter specifies the operating frequency, storage place for
program data, programming destination address, and erase block and exchanges the processing
result for the downloaded on-chip program. This parameter uses the general registers of the CPU
(ER0 and ER1) or the on-chip RAM area. The initial value is undefined at a power-on reset or in
hardware standby mode.
When download, initialization, or on-chip program is executed, registers of the CPU except for
ER0 and ER1 are stored. The return value of the processing result is written in ER0, ER1. Since
the stack area is used for storing the registers except for ER0, ER1, the stack area must be saved at
the processing start. (A maximum size of a stack area to be used is 128 bytes.)
The programming/erasing interface parameter is used in the following four items.
1. Download control
2. Initialization before programming or erasing
3. Programming
4. Erasing
These items use different parameters. The correspondence table is shown in table 21.4. The
meaning of the bits in FPFR varies in each processing program: initialization, programming, or
erasure. For details, see descriptions of FPFR for each process.
Rev.7.00 Mar. 18, 2009 page 879 of 1136
REJ09B0109-0700