DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 257

IC H8S MCU FLASH 3V 384K 144LQFP

DF2377RVFQ33W

Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2377RVFQ33W

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.5.6
Some external I/O devices require a setup time and hold time between address and CS signals and
strobe signals such as RD, HWR, and LWR. Settings can be made in the CSACR register to insert
states in which only the CS, AS, and address signals are asserted before and after a basic bus space
access cycle. Extension of the CS assertion period can be set for individual areas. With the CS
assertion extension period in write access, the data setup and hold times are less stringent since the
write data is output to the data bus.
RDNn = 0
RDNn = 1
Extension of Chip Select (CS) Assertion Period
φ
Address bus
CSn
AS
RD
Data bus
RD
Data bus
DACK,
EDACK
Figure 6.19 Example of Read Strobe Timing
T
1
Rev.7.00 Mar. 18, 2009 page 189 of 1136
Bus cycle
T
2
Section 6 Bus Controller (BSC)
REJ09B0109-0700
T
3

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