DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 985
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2377RVFQ33
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Notes: 1. Transferring the data to the on-chip RAM enables this area to be used.
Operation for Settings
of Program Parameter
Execution of
Programming
Determination of
Program Result
Operation for Program
Error
Operation for FKEY
Clear
Switching MATs by
FMATS
2. Switching FMATS by a program in the on-chip RAM enables this area to be used.
Item
On-chip
RAM
Storable/Executable Area
User
Boot
MAT
× *
×
×
×
×
×
2
Section 21 Flash Memory (0.18-μm F-ZTAT Version)
(Expanded
External
Space
Mode)
×
×
Rev.7.00 Mar. 18, 2009 page 917 of 1136
User
MAT
Selected MAT
Boot
User
MAT
REJ09B0109-0700
Storage Area
Embedded
Program
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