DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 270
![IC H8S MCU FLASH 3V 384K 144LQFP](/photos/28/61/286116/144-lqfp__plqp0144kc-a_sml.jpg)
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 6 Bus Controller (BSC)
6.6.10
When DRAM with a ×16-bit configuration is connected, the 2-CAS access method is used for the
control signals needed for byte access. Figure 6.28 shows the control timing for 2-CAS access,
and figure 6.29 shows an example of 2-CAS DRAM connection.
Rev.7.00 Mar. 18, 2009 page 202 of 1136
REJ09B0109-0700
φ
Address bus
RASn (CSn)
UCAS
LCAS
WE (HWR)
OE (RD)
Upper data bus
Lower data bus
Note: n = 2 to 5
Byte Access Control
(Upper Byte Write Access: RAST = 0, CAST = 0)
Figure 6.28 2-CAS Control Timing
T
p
Row address
High
High
T
r
T
c1
Column address
High impedance
Write data
T
c2
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