MCF5235CVM150J Freescale Semiconductor, MCF5235CVM150J Datasheet - Page 24

• Manufacturer Part Number: MCF5235CVM150J
• Description: IC MCU 64K 150MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF523xr

Specifications of MCF5235CVM150J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 97
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF523x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, UART, Ethernet, SPI
• Maximum Clock Frequency: 150 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 1.4 V to 1.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5234-KIT
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 64 KB
• Cpu Speed: 150MHz
• Embedded Interface Type: CAN, EMI, ETHERNET, I2C, SPI, UART, USB
• Digital Ic Case Style: MAPBGA
• No. Of Pins: 256
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Electrical Characteristics
7.2
The below table lists thermal resistance values.
24
1
2
3
4
5
6
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the Ψ
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
At 100MHz.
JMA
and Ψ
Thermal Characteristics
1
2
3
4
5
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Functional operating conditions are given in DC Electrical Specifications. Absolute Maximum
Ratings are stress ratings only, and functional operation at the maxima is not guaranteed.
Continued operation at these levels may affect device reliability or cause permanent damage
to the device.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application of
any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of
operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either V
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages,
then use the larger of the two values.
All functional non-supply pins are internally clamped to V
Power supply must maintain regulation within operating OV
and operating maximum current conditions. If positive injection current (V
than I
going out of regulation. Insure external OV
injection current. This will be the greatest risk when the processor is not consuming power
(ex; no clock).Power supply must maintain regulation within operating OV
instantaneous and operating maximum current conditions.
DD
SS
, the injection current may flow out of OV
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
or OV
Characteristic
JmA
and power dissipation specifications in the system design to prevent device junction
DD
).
Table 8. Thermal Characteristics
Four layer board (2s2p)
Four layer board (2s2p)
DD
load will shunt current greater than maximum
DD
and could result in external power supply
Symbol
SS
θ
θ
θ
θ
Ψ
JMA
JMA
T
JB
JC
DD
jt
j
and OV
range during instantaneous
MAPBGA
DD
26
23
256
2
102
15
10
.
1,5
1,2
1,2
3
4
in
DD
> OV
range during
MAPBGA
DD
32
29
196
2
104
20
10
) is greater
1,5
1,2
1,2
Freescale Semiconductor
3
4
40
36
QFP
105
160
2
25
10
1,5
1,2
1,2
3
4
6
jt
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
C