MCF5235CVM150J Freescale Semiconductor, MCF5235CVM150J Datasheet - Page 20

• Manufacturer Part Number: MCF5235CVM150J
• Description: IC MCU 64K 150MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF523xr

Specifications of MCF5235CVM150J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 97
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF523x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, UART, Ethernet, SPI
• Maximum Clock Frequency: 150 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 1.4 V to 1.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5234-KIT
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 64 KB
• Cpu Speed: 150MHz
• Embedded Interface Type: CAN, EMI, ETHERNET, I2C, SPI, UART, USB
• Digital Ic Case Style: MAPBGA
• No. Of Pins: 256
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Mechanicals/Pinouts and Part Numbers
6.2.2
Figure 7
20
15X
e
Y
E
shows MCF5235CVMxxx, MCF5234CVMxxx, and MCF5233CVMxx package dimensions.
S
X
Package Dimensions—256 MAPBGA
0.20
16
15
14
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
13
12
11
VIEW M-M
10
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
D
7
6
5
15X
S
4
3
e
2
1
Figure 7. 256 MAPBGA Package Outline
G
M
A
B
C
D
E
F
H
J
K
L
N
P
R
T
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
K
256X
M
M
0.25
0.10
b
3
M
M
Z
Z
X
Y
A
A2
A1
Z
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
4
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DETAIL K
DIM
A1
A2
A
D
E
S
b
e
°
MILLIMETERS
MIN
1.25
0.27
0.40
256X
17.00 BSC
17.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
0.15
MAX
1.60
0.47
0.60
Freescale Semiconductor
Z
0.30
5
Z