MCF5235CVM150J Freescale Semiconductor, MCF5235CVM150J Datasheet - Page 14

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MCF5235CVM150J

Manufacturer Part Number
MCF5235CVM150J
Description
IC MCU 64K 150MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF523xr
Datasheet

Specifications of MCF5235CVM150J

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
97
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Processor Series
MCF523x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, UART, Ethernet, SPI
Maximum Clock Frequency
150 MHz
Number Of Timers
4
Operating Supply Voltage
1.4 V to 1.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5234-KIT
Minimum Operating Temperature
- 40 C
Program Memory Size
64 KB
Cpu Speed
150MHz
Embedded Interface Type
CAN, EMI, ETHERNET, I2C, SPI, UART, USB
Digital Ic Case Style
MAPBGA
No. Of Pins
256
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5235CVM150J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Mechanicals/Pinouts and Part Numbers
5.7.3
The FlexCAN module interface to the CAN bus is composed of 2 pins: CANTX and CANRX, which are
the serial transmitted data and the serial received data. The use of an external CAN transceiver to interface
to the CAN bus is generally required. The transceiver is capable of driving the large current needed for the
CAN bus and has current protection, against a defective CAN bus or defective stations.
5.7.4
Use the BDM interface as shown in the M523xEVB evaluation board user’s manual. The schematics for
this board are accessible at the Freescale website at: http://www.freescale.com/coldfire.
6
This section contains drawings showing the pinout and the packaging and mechanical characteristics of
the MCF523x devices. See
14
Mechanicals/Pinouts and Part Numbers
FlexCAN
BDM
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
Table 2
for a list the signal names and pin locations for each device.
Freescale Semiconductor

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