MCF5235CVM150J Freescale Semiconductor, MCF5235CVM150J Datasheet - Page 16

• Manufacturer Part Number: MCF5235CVM150J
• Description: IC MCU 64K 150MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF523xr

Specifications of MCF5235CVM150J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 97
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF523x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, UART, Ethernet, SPI
• Maximum Clock Frequency: 150 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 1.4 V to 1.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5234-KIT
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 64 KB
• Cpu Speed: 150MHz
• Embedded Interface Type: CAN, EMI, ETHERNET, I2C, SPI, UART, USB
• Digital Ic Case Style: MAPBGA
• No. Of Pins: 256
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Mechanicals/Pinouts and Part Numbers
6.2
Figure 3
16
196X
13X
3
e
X
E
Y
b
0.15
0.08 Z
shows MCF5232CVMxxx package dimensions.
S
Package Dimensions—196 MAPBGA
TOL
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
Figure 3. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
10 9
View M-M
D
6
13X
S
5 4
e
3 2
1
M
C
D
G
H
N
A
B
E
F
J
K
L
P
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90° Clockwise
NOTES:
1.
2.
3.
4.
5.
Z
Dimensions are in millimeters.
Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
Dimension b is measured at the
maximum solder ball diameter,
parallel to datum plane Z.
Datum Z (seating plane) is defined
by the spherical crowns of the solder
balls.
Parallelism measurement shall
exclude any effect of mark on top
surface of package.
DIM
A1
A2
Detail K
A
D
b
E
e
S
4
Min
1.25
0.27
0.45
Millimeters
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
Freescale Semiconductor
1.16 REF
196X
0.10 Z
Max
1.60
0.47
0.55
5
0.20 Z