MC9S08RG60CFGE Freescale Semiconductor, MC9S08RG60CFGE Datasheet - Page 206

• Manufacturer Part Number: MC9S08RG60CFGE
• Description: IC MCU 60K FLASH 8MHZ 44LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08RG60CFGE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LQFP
• Processor Series: S08RG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08RG60E
• Minimum Operating Temperature: - 40 C
• Controller Family/series: HCS08
• No. Of I/o's: 39
• Ram Memory Size: 60KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• For Use With: DEMO9S08RG60E - BOARD DEMO S08RG/RC/RD/RE FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical Characteristics
A.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take P
actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
small.
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving equations 1 and 2 iteratively for any value of T
206
D
(at equilibrium) for a known T
I/O
T
θ
P
P
P
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
Operating temperature range (packaged)
Thermal resistance
+ P
× V
28-pin PDIP
28-pin SOIC
44-pin LQFP
48-pin QFN
32-pin LQFP
I/O
DD
, Watts — chip internal power
I/O
SS
or V
<< P
Rating
K = P
I/O
DD
int
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
A
into account in power calculations, determine the difference between
and can be neglected. An approximate relationship between P
and multiply by the pin current for each I/O pin. Except in cases of
. Using this value of K, the values of P
Table A-2. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
) in °C can be obtained from:
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
A
JA
JA
.
Symbol
)
θ
× (P
T
JA
A
D
)
2
–40 to 85
T
Value
L
D
75
70
72
70
82
to T
and T
H
J
SS
can be obtained by
Freescale Semiconductor
or V
°C/W
Unit
°C
DD
will be very
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
J