MC9S08RG60CFGE Freescale Semiconductor, MC9S08RG60CFGE Datasheet - Page 17
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MC9S08RG60CFGE
Manufacturer Part Number
MC9S08RG60CFGE
Description
IC MCU 60K FLASH 8MHZ 44LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08RE8FJE.pdf
(234 pages)
Specifications of MC9S08RG60CFGE
Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-LQFP
Processor Series
S08RG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
- 40 C
Controller Family/series
HCS08
No. Of I/o's
39
Ram Memory Size
60KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
For Use With
DEMO9S08RG60E - BOARD DEMO S08RG/RC/RD/RE FAMILY
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08RG60CFGE
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MC9S08RG60CFGE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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1.3
This block diagram shows the structure of the MC9S08RC/RD/RE/RG MCUs
Table 1-2
Freescale Semiconductor
EXTAL
XTAL
NOTES:
V
V
DD
SS
1. Port pins are software configurable with pullup device if input port
2. PTA0 does not have a clamp diode to V
3. IRQ pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1)
4. The RESET pin contains integrated pullup device enabled if reset enabled (RSTPE = 1)
5. High current drive
6. Pins PTA[7:4] contain both pullup and pulldown devices. Pulldown enabled when KBI is enabled (KBIPEn = 1) and
V
rising edge is selected (KBEDGn = 1).
MCU Block Diagram
lists the functional versions of the on-chip modules.
DD
(RC/RD/RE/RG32/60 = 2048 BYTES)
(RC/RD/RE/RG60 = 63,364 BYTES)
(RC/RD/RE/RG32 = 32,768 BYTES)
(RC/RD/RE8/16 = 1024 BYTES)
when internal pullup is enabled.
(RC/RD/RE16 = 16,384 BYTES)
LOW-POWER OSCILLATOR
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
(RC/RD/RE8 = 8192 BYTES)
MODES OF OPERATION
POWER MANAGEMENT
BDC
IRQ
RTI
HCS08 CORE
REGULATOR
USER FLASH
USER RAM
VOLTAGE
COP
CPU
LVD
Figure 1-1. MC9S08RC/RD/RE/RG Block Diagram
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
DD
INTERFACE MODULE (SCI1)
INTERRUPT MODULE (KBI1)
INTERRUPT MODULE (KBI2)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SPI1)
. PTA0 should not be driven above V
2-CHANNEL TIMER/PWM
ANALOG COMPARATOR
CARRIER MODULATOR
TIMER MODULE (CMT)
SERIAL PERIPHERAL
MODULE (ACMP1)
8-BIT KEYBOARD
4-BIT KEYBOARD
MODULE (TPM1)
MODULE (DBG)
DEBUG
INTERNAL BUS
DD
. Also, PTA0 does not pullup to
7
8
IRO NOTE 5
PTC7/SS1
PTC6/SPSCK1
PTC5/MISO1
PTC4/MOSI1
PTC3/KBI2P3
PTC2/KBI2P2
PTC1/KBI2P1
PTC0/KBI2P0
PTA7/KBI1P7–
PTA1/KBI1P1
PTA0/KBI1P0
PTE7–
PTB7/TPM1CH1
PTE6
PTB5
PTB4
PTB3
PTB2
PTB1/RxD1
PTB0/TxD1
PTD6/TPM1CH0
PTD5/ACMP1+
PTD4/ACMP1–
PTD3
PTD2/IRQ
PTD1/RESET
PTD0/BKGD/MS
PTE0
NOTE 1
Introduction
NOTES1, 2, 6
NOTES 1, 5
NOTE 1
NOTES
1, 3, 4
17
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