MC9S08QD2MSCR Freescale Semiconductor, MC9S08QD2MSCR Datasheet - Page 18

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MC9S08QD2MSCR

Manufacturer Part Number
MC9S08QD2MSCR
Description
IC MCU 8BIT 8-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08QD2MSCR

Core Processor
HCS08
Core Size
8-Bit
Speed
16MHz
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
4
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-SOIC (3.9mm Width)
Processor Series
S08QD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
128 B
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08QD4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
 Details
Chapter 1 Device Overview
1.3
Figure 1-2
inputs as shown. The clock inputs to the modules indicate the clock(s) that are used to drive the module
function. All memory mapped registers associated with the modules are clocked with BUSCLK.
18
1
2
3
ICSLCLK is the alternate BDC clock source for the MC9S08QD4 series.
ADC has min. and max frequency requirements. See ADC chapter and
Flash has frequency requirements for program and erase operation.See
ICS
System Clock Distribution
shows a simplified clock connection diagram. Some modules in the MCU have selectable clock
ICSIRCLK
ICSFFCLK
ICSLCLK
ICSOUT
1
SYSTEM CONTROL LOGIC
Analog-to-Digital Converter
Central Processing Unit
Internal Clock Source
Keyboard Interrupt
Timer Pulse-Width Modulator
CPU
÷
Figure 1-2. System Clock Distribution Diagram
2
÷
2
Table 1-2. Versions of On-Chip Modules
MC9S08QD4 Series MCU Data Sheet, Rev. 6
COP
RTI
FIXED FREQ CLOCK (XCLK)
Module
BUSCLK
BDC
(ADC)
(CPU)
(ICS)
(KBI)
(TPM)
TCLK1
TPM1
Appendix A, “Electrical
Appendix A, “Electrical
TCLK2
TPM2
Version
ADC
1
2
1
2
2
2
Characteristics.”
Characteristics.”
Freescale Semiconductor
FLASH
3

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