MC9S08QD2MSCR Freescale Semiconductor, MC9S08QD2MSCR Datasheet - Page 14

• Manufacturer Part Number: MC9S08QD2MSCR
• Description: IC MCU 8BIT 8-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QD2MSCR

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 16MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: S08QD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QD4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

12.1 Introduction ...................................................................................................................................159
12.2 Background Debug Controller (BDC) ..........................................................................................160
12.3 Register Definition ........................................................................................................................167
A.1 Introduction ...................................................................................................................................173
A.2 Absolute Maximum Ratings ..........................................................................................................173
A.3 Thermal Characteristics .................................................................................................................174
A.4 ESD Protection and Latch-Up Immunity ......................................................................................175
A.5 DC Characteristics .........................................................................................................................175
A.6 Supply Current Characteristics ......................................................................................................182
A.7 Internal Clock Source Characteristics ...........................................................................................184
A.8 AC Characteristics .........................................................................................................................186
A.9 ADC Characteristics ......................................................................................................................188
A.10 Flash Specifications .......................................................................................................................189
B.1 Ordering Information ....................................................................................................................191
B.2 Mechanical Drawings ....................................................................................................................192
14
12.1.1 Forcing Active Background ............................................................................................159
12.1.2 Module Configuration .....................................................................................................159
12.1.3 Features ...........................................................................................................................160
12.2.1 BKGD Pin Description ...................................................................................................161
12.2.2 Communication Details ..................................................................................................161
12.2.3 BDC Commands .............................................................................................................164
12.2.4 BDC Hardware Breakpoint .............................................................................................167
12.3.1 BDC Registers and Control Bits .....................................................................................168
12.3.2 System Background Debug Force Reset Register (SBDFR) ..........................................170
A.8.1 Control Timing ...............................................................................................................186
A.8.2 Timer/PWM (TPM) Module Timing ..............................................................................187
B.1.1 Device Numbering Scheme ............................................................................................191
Ordering Information and Mechanical Drawings
MC9S08QD4 Series MCU Data Sheet, Rev. 6
Electrical Characteristics
Development Support
Appendix A
Appendix B
Chapter 12
Freescale Semiconductor