PIC18LF1330-I/SO Microchip Technology, PIC18LF1330-I/SO Datasheet - Page 297

• Manufacturer Part Number: PIC18LF1330-I/SO
• Description: IC PIC MCU FLASH 4KX16 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18LF1330-I/SO

• Core Size: 8-Bit
• Program Memory Size: 8KB (4K x 16)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 16
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 256Byte
• Cpu Speed: 40MHz
• No.: RoHS Compliant
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

 2009 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
D
A
E
α
e
h
L
φ
c
b
β
φ
2.05
0.10
0.25
0.40
0.20
0.31
MIN
L
0°
5°
5°
–
h
PIC18F1230/1330
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
h
β
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS39758D-page 297
c