PIC18F2331-E/MM Microchip Technology, PIC18F2331-E/MM Datasheet - Page 376

IC MCU FLASH 4KX16 28QFN

PIC18F2331-E/MM

Manufacturer Part Number
PIC18F2331-E/MM
Description
IC MCU FLASH 4KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2331-E/MM

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-QFN
Core
PIC
Processor Series
PIC18F
Data Bus Width
8 bit
Maximum Clock Frequency
40 MHz
Data Ram Size
768 B
Data Rom Size
256 B
On-chip Adc
Yes
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
5
Height
0.88 mm
Interface Type
EUSART, I2C, SPI, SSP
Length
6 mm
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V, 5.8 V
Supply Voltage (min)
3.9 V, 4.2 V
Width
6 mm
For Use With
I3-DB18F4431 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Other names
PIC18F2331-E/ML
PIC18F2331-E/ML
PIC18F2331/2431/4331/4431
APPENDIX C:
This appendix discusses the considerations for
converting from previous versions of a device to the
ones listed in this data sheet. Typically, these changes
are due to the differences in the process technology
used. An example of this type of conversion is from a
PIC16C74A to a PIC16C74B.
DS39616D-page 376
Not Applicable
CONVERSION
CONSIDERATIONS
APPENDIX D:
This section discusses how to migrate from a baseline
device (i.e., PIC16C5X) to an enhanced MCU device
(i.e., PIC18FXXX).
The following are the list of modifications over the
PIC16C5X microcontroller family:
Not Currently Available
MIGRATION FROM
BASELINE TO
ENHANCED DEVICES
 2010 Microchip Technology Inc.

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