DF2338VFC25V Renesas Electronics America, DF2338VFC25V Datasheet - Page 909

IC H8S/2300 MCU FLASH 144QFP

DF2338VFC25V

Manufacturer Part Number
DF2338VFC25V
Description
IC H8S/2300 MCU FLASH 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2338VFC25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2338VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(2) Control Signal Timing
Table 22.5 Control Signal Timing
Condition A: V
Condition B: V
Item
RES setup time
RES pulse width
NMI setup time
NMI hold time
NMI pulse width (in recovery
from software standby mode)
IRQ setup time
IRQ hold time
IRQ pulse width (in recovery
from software standby mode)
0 V, φ = 2 MHz to 20 MHz, T
T
0 V, φ = 2 MHz to 25 MHz, T
T
a
a
CC
CC
= –40°C to 85°C (wide-range specifications)
= –40°C to 85°C (wide-range specifications)
= 2.7 V to 3.6 V, AV
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
RESS
RESW
NMIS
NMIH
NMIW
IRQS
IRQH
IRQW
CC
CC
= 2.7 V to 3.6 V, V
= 3.0 V to 3.6 V, V
Min
200
20
150
10
200
150
10
200
a
a
Condition A
= –20°C to 75°C (regular specifications),
= –20°C to 75°C (regular specifications),
Max
Rev.4.00 Sep. 07, 2007 Page 877 of 1210
ref
ref
Min
200
20
150
10
200
150
10
200
Condition B
= 2.7 V to AV
= 3.0 V to AV
Max
Unit
ns
t
ns
ns
cyc
CC
CC
REJ09B0245-0400
, V
, V
SS
SS
Test
Conditions
Figure 22.4
Figure 22.5
= AV
= AV
SS
SS
=
=

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