DF2338VFC25V Renesas Electronics America, DF2338VFC25V Datasheet - Page 215

• Manufacturer Part Number: DF2338VFC25V
• Description: IC H8S/2300 MCU FLASH 144QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2338VFC25V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• For Use With: EDK2329 - DEV EVALUATION KIT H8S/2329
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

6.6
When burst mode is selected with the DRAM interface, the DACK output timing can be selected
with the DDS bit. When DRAM space is accessed in DMAC single address mode at the same
time, the DDS bit selects whether or not burst access is to be performed.
6.6.1
Burst access is performed by determining the address only, irrespective of the bus master. With
the DRAM interface, the DACK output goes low from the T
Figure 6.28 shows the DACK output timing for the DRAM interface when DDS = 1.
Note: n = 2 to 5
Read
Write
Figure 6.28 DACK Output Timing when DDS = 1 (Example of DRAM Access)
DMAC Single Address Mode and DRAM Interface
When DDS = 1
A
CS
CAS (UCAS)
LCAS (LCAS)
HWR (WE)
D
HWR (WE)
D
DACK
φ
23
15
15
n
to A
to D
to D
(RAS)
0
0
0
T
p
Row
T
r
Rev.4.00 Sep. 07, 2007 Page 183 of 1210
c1
state.
T
c1
Column
T
c2
REJ09B0245-0400