ST72F324BJ6B6 STMicroelectronics, ST72F324BJ6B6 Datasheet - Page 177

• Manufacturer Part Number: ST72F324BJ6B6
• Description: MCU 8BIT 32KB FLASH/ROM 42-SDIP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F324BJ6B6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Controller Family/series: ST7
• No. Of I/o's: 32
• Ram Memory Size: 1KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• No. Of Pwm Channels: 3
• Processor Series: ST72F3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• For Use With: 497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-5589-5

ST72324Bxx
13.3
Thermal characteristics
Table 118. Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
of an application can be defined by the user with the formula: P
internal power (I
application.
Symbol
T
R
Jmax
P
thJA
D
Package thermal resistance (junction to ambient):
Power dissipation
Maximum junction temperature
DD
x V
DD
) and P
PORT
(1)
is the port power dissipation depending on the ports used in the
Ratings
(2)
LQFP44 10x10
LQFP32 7x7
DIP42 600mil
SDIP32 200mil
D
D
= P
= (T
INT
J
-T
+ P
A
) / R
PORT
Package characteristics
thJA
where P
. The power dissipation
Value
500
150
52
70
55
50
INT
is the chip
177/193
°C/W
Unit
mW
°C