LPC3250FET296,551 NXP Semiconductors, LPC3250FET296,551 Datasheet - Page 71
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LPC3250FET296,551
Manufacturer Part Number
LPC3250FET296,551
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheet
1.OM11079.pdf
(77 pages)
Specifications of LPC3250FET296,551
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
296-TFBGA
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
I2C, I2S, UART, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
Development Tools By Supplier
OM11016, OM11021, OM11045
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
OM11021 - EVAL LPC-STICK WITH LPC3250OM11016 - KIT DEVELOPMENT LPC3250568-4743 - KIT LCD TOUCH 5.7" FOR LPC3250568-4742 - MODULE DIMM LPC2478 ARM7622-1030 - KIT LCD TOUCH 5.7" FOR LPC3250
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Other names
568-4533
935287084551
935287084551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
BONENS
Quantity:
98
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
13. Abbreviations
LPC3220_30_40_50_1
Product data sheet
Table 20.
Acronym
ADC
AHB
AMBA
APB
BSDL
CISC
DDR SDRAM
DMA
DSP
ETM
FAB
FIFO
FIQ
GPIO
I/O
IRQ
HS
IrDA
JTAG
LCD
MAC
MIIM
OHCI
OTG
PHY
PLL
PWM
RAM
RMII
SE0
SDR SDRAM
SPI
SSI
SSP
TFT
TTL
STN
Abbreviations
All information provided in this document is subject to legal disclaimers.
Advanced Microcontroller Bus Architecture
Boundary Scan Description Language
Complex Instruction Set Computer
Double Data Rate Synchronous Dynamic Random Access Memory
Interrupt Request
Media Access Control
Media Independent Interface Management
Open Host Controller Interface
On-The-Go
Reduced Media Independent Interface
Description
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Peripheral Bus
Direct Memory Access
Digital Signal Processing
Embedded Trace Macrocell
Fast Access Bus
First In, First Out
Fast Interrupt Request
General Purpose Input/Output
Input/Output
High-Speed
Infrared Data Association
Joint Test Action Group
Liquid Crystal Display
Physical Layer
Phase-Locked Loop
Pulse Width Modulator
Random Access Memory
Single Ended Zero
Single Data Rate Synchronous Dynamic Random Access Memory
Serial Peripheral Interface
Serial Synchronous Interface
Synchronous Serial Port
Thin Film Transistor
Transistor-Transistor Logic
Super Twisted Nematic
Rev. 01.03 — 16 March 2010
LPC3220/30/40/50
16/32-bit ARM microcontrollers
© NXP B.V. 2010. All rights reserved.
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