LPC3250FET296,551 NXP Semiconductors, LPC3250FET296,551 Datasheet - Page 61
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LPC3250FET296,551
Manufacturer Part Number
LPC3250FET296,551
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheet
1.OM11079.pdf
(77 pages)
Specifications of LPC3250FET296,551
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
296-TFBGA
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
I2C, I2S, UART, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
Development Tools By Supplier
OM11016, OM11021, OM11045
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
OM11021 - EVAL LPC-STICK WITH LPC3250OM11016 - KIT DEVELOPMENT LPC3250568-4743 - KIT LCD TOUCH 5.7" FOR LPC3250568-4742 - MODULE DIMM LPC2478 ARM7622-1030 - KIT LCD TOUCH 5.7" FOR LPC3250
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Other names
568-4533
935287084551
935287084551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
BONENS
Quantity:
98
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 15.
V
[1]
Table 16.
T
[1]
[2]
LPC3220_30_40_50_1
Product data sheet
Symbol Parameter
T
t
t
t
t
Symbol
t
t
su(D)
h(D)
d(QV)
h(Q)
DD(IO)
amb
TIO
TOI
cy(clk)
Parameters are valid over operating temperature range unless otherwise specified.
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
=
−
= 3.3 V; T
40
clock cycle time
data input set-up time
data input hold time
data output valid delay time
data output hold time
°
Dynamic characteristics USB digital I/O pins
Dynamic characteristics: SD card pin interface
C to +85
Parameter
bus turnaround time (I/O)
bus turnaround time (O/I)
11.5 USB controller
11.6 Secure Digital (SD) card interface
amb
=
°
C for industrial applications; V
−
40
Fig 13. USB bus turnaround time
°
C to +85
USB_DAT_VP
USB_SE0_VM
USB_OE_TP
°
C, unless otherwise specified.
All information provided in this document is subject to legal disclaimers.
Conditions
on pin MS_SCLK; Data transfer mode
on pin MS_SCLK; Identification mode
on pins MS_BS, MS_DIO[3:0] as inputs
on pins MS_BS, MS_DIO[3:0] as inputs
on pins MS_BS, MS_DIO[3:0] as outputs
on pins MS_BS, MS_DIO[3:0] as outputs
Conditions
OE_N/INT_N to DAT/VP and SE0/VM
OE_N/INT_N to DAT/VP and SE0/VM
Rev. 01.03 — 16 March 2010
DD(IO)
input
over specified ranges.
t
TIO
[1]
output
[1]
LPC3220/30/40/50
t
Min
-
-
TOI
16/32-bit ARM microcontrollers
Min
-
-
-
-
-
-
Typ
7
0
Typ
-
-
2.7
0
9.7
7.7
input
[2]
© NXP B.V. 2010. All rights reserved.
002aae440
Max
-
-
Max
25
400
-
-
-
-
Unit
MHz
kHz
ns
ns
ns
ns
61 of 77
Unit
ns
ns