LPC3250FET296,551 NXP Semiconductors, LPC3250FET296,551 Datasheet - Page 58
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LPC3250FET296,551
Manufacturer Part Number
LPC3250FET296,551
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheet
1.OM11079.pdf
(77 pages)
Specifications of LPC3250FET296,551
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
296-TFBGA
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
I2C, I2S, UART, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
Development Tools By Supplier
OM11016, OM11021, OM11045
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
OM11021 - EVAL LPC-STICK WITH LPC3250OM11016 - KIT DEVELOPMENT LPC3250568-4743 - KIT LCD TOUCH 5.7" FOR LPC3250568-4742 - MODULE DIMM LPC2478 ARM7622-1030 - KIT LCD TOUCH 5.7" FOR LPC3250
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Details
Other names
568-4533
935287084551
935287084551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
BONENS
Quantity:
98
Company:
Part Number:
LPC3250FET296,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 13.
C
[1]
[2]
[3]
[4]
[5]
[6]
LPC3220_30_40_50_1
Product data sheet
Symbol
f
t
t
t
t
t
t
t
t
t
t
t
t
oper
CK
CL
CH
d(V)ctrl
h(ctrl)
d(AV)
h(A)
d(QV)
h(Q)
su(D)
h(D)
QZ
L
= 25 pF, T
Parameters are valid over operating temperature range unless otherwise specified.
Typical values valid for EMC pads set to fast slew rate: VDD_EMC = 1.8 V, VDD_CORE = 1.2 V or slower slew rate: VDD_EMC = 3.3 V,
VDD_CORE = 1.2 V (see SDRAMCLK_CTRL register in the LPC32x0 User manual).
All min or max values valid for EMC pads set to fast slew rate: VDD_EMC = 1.8 V, VDD_CORE = 1.2 V or slower slew rate: VDD_EMC
= 3.3 V, VDD_CORE = 1.2 V.
f
Applies to signals: EMC_DQM[3:0], EMC_DYCSm, EMC_RAS, EMC_CAS, EMC_WR, EMC_CKEm.
CMD_DLY = COMMAND_DELAY bitfield in SDRAMCLK_CTRL[18:14] register, see External memory controller (EMC) chapter in
LPC32x0 User manual.
oper
= 1/t
EMC SDR SDRAM memory interface dynamic characteristics
CK.
amb
Parameter
operating frequency
clock cycle time
CK LOW-level width
CK HIGH-level width
control valid delay time
control hold time
address valid delay time
address hold time
data output valid delay time
data output hold time
data input set-up time
data input hold time
data output high-impedance time
11.3 SDR SDRAM Controller
=
−
40
°
C to +85
Fig 9.
°
C, unless otherwise specified.
SDR SDRAM signal timing
All information provided in this document is subject to legal disclaimers.
output signal (O)
input signal (I)
EMC_CLK
Rev. 01.03 — 16 March 2010
[5][6]
[5][6]
[4]
[6]
[6]
[6]
[6]
-
Min
7.5
-
-
-
-
-
-
-
t
d(V)ctrl
[1][3]
, t
Typical
104
9.6
4.8
4.8
(CMD_DLY × 0.25) + 2.7
(CMD_DLY × 0.25) + 1.2
(CMD_DLY × 0.25) + 3.2
(CMD_DLY × 0.25) + 1.2
(CMD_DLY × 0.25) + 3.5
(CMD_DLY × 0.25) + 1.2
0.6
0.9
-
t
d(AV)
CH
, t
d(QV)
[2]
t
CK
LPC3220/30/40/50
t
CL
t
su(D)
16/32-bit ARM microcontrollers
t
t
h(ctrl)
h(D)
, t
t
002aae420
QZ
h(Q)
, t
h(A)
Max
133
-
-
-
-
-
-
-
-
< t
© NXP B.V. 2010. All rights reserved.
CK
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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