ATMEGA3250P-20AU Atmel, ATMEGA3250P-20AU Datasheet - Page 3

• Manufacturer Part Number: ATMEGA3250P-20AU
• Description: IC MCU AVR 32K FLASH 100-TQFP
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA3250P-20AU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Processor Series: ATMEGA32x
• Core: AVR8
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SPI/UART/USI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 69
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• For Use With: ATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK504 - STARTER KIT AVR EXP MOD 100P LCD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ATMEGA3250P-16AU; ATMEGA3250P-16AU

1.1
2. Overview
The ATmega325P/3250P is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By
executing powerful instructions in a single clock cycle, the ATmega325P/3250P achieves throughputs approaching 1 MIPS
per MHz allowing the system designer to optimize power consumption versus processing speed.
8023F–AVR–07/09
Disclaimer
Figure 1-2.
Note:
Typical values contained in this datasheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.
(USCK/SCL/PCINT4) PE4
The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
(XCK/AIN0/PCINT2) PE2
(OC0A/PCINT12) PB4
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(DI/SDA/PCINT5) PE5
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(CLKO/PCINT7) PE7
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(SCK/PCINT9) PB1
(TXD/PCINT1) PE1
(DO/PCINT6) PE6
(SS/PCINT8) PB0
Pinout ATmega325P
DNC
10
11
12
14
15
16
13
1
2
3
4
5
6
7
8
9
INDEX CORNER
ATmega325
ATmega325P/3250P
39
38
35
34
33
48
47
46
45
44
43
42
41
40
37
36
PA3
PA4
PA5
PA6
PA7
PG2
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PG1
PG0
3