PIC18F2331-I/SP Microchip Technology, PIC18F2331-I/SP Datasheet - Page 378

IC PIC MCU FLASH 4KX16 28DIP

PIC18F2331-I/SP

Manufacturer Part Number
PIC18F2331-I/SP
Description
IC PIC MCU FLASH 4KX16 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2331-I/SP

Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART/I2C/SPI/SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DM183021, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4431 - BOARD DAUGHTER ICEPIC3AC164035 - MODULE SKT FOR 18F2X31 28SOICDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2331-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F2331/2431/4331/4431
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
DS39616B-page 376
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
E1
B1
eB
A1
D
p
A
E
L
B
A
n
c
A1
Preliminary
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
13.46
51.94
15.75
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
15.24
13.84
52.26
16.51
4.45
2.54
3.30
0.29
1.27
0.46
3.81
40
10
10
p
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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