PIC18F2331-I/SP Microchip Technology, PIC18F2331-I/SP Datasheet - Page 318

• Manufacturer Part Number: PIC18F2331-I/SP
• Description: IC PIC MCU FLASH 4KX16 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2331-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3-DB18F4431 - BOARD DAUGHTER ICEPIC3AC164035 - MODULE SKT FOR 18F2X31 28SOICDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2331/2431/4331/4431
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39616B-page 316
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)
TOS
PC
Q1
operation
Pop Top of Return Stack
[ label ]
None
(TOS)
None
The TOS value is pulled off the
return stack and is discarded. The
TOS value then becomes the
previous value that was pushed
onto the return stack.
This instruction is provided to
enable the user to properly manage
the return stack to incorporate a
software stack.
1
1
POP
GOTO
0000
No
Q2
bit bucket
POP
0000
NEW
POP TOS
=
=
=
=
value
Q3
0x0031A2
0x014332
0x014332
NEW
0000
operation
No
Q4
0110
Preliminary
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PUSH PC+2
onto return
Push Top of Return Stack
[ label ]
None
(PC+2)
None
The PC+2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows to implement
a software stack by modifying TOS,
and then push it onto the return
stack.
1
1
PUSH
stack
0000
Q2
 2003 Microchip Technology Inc.
PUSH
TOS
0000
operation
=
=
=
=
=
No
Q3
0x00345A
0x000124
0x000126
0x000126
0x00345A
0000
operation
No
Q4
0101