PIC18F2331-I/SP Microchip Technology, PIC18F2331-I/SP Datasheet - Page 376

• Manufacturer Part Number: PIC18F2331-I/SP
• Description: IC PIC MCU FLASH 4KX16 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2331-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3-DB18F4431 - BOARD DAUGHTER ICEPIC3AC164035 - MODULE SKT FOR 18F2X31 28SOICDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2331/2431/4331/4431
27.2
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
DS39616B-page 374
Package Details
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
eB
A2
E1
B1
A1
D
A
E
B
n
p
L
c
MIN
Preliminary
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
28
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
 2003 Microchip Technology Inc.
5
5
MILLIMETERS
p
NOM
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
28
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15