PIC12F635-I/P Microchip Technology, PIC12F635-I/P Datasheet - Page 184

• Manufacturer Part Number: PIC12F635-I/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F635/PIC16F636/639
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
DS41232B-page 182
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
B
c
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
A
E
D
n
p
L
c
B
MIN
Preliminary
.033
.002
.246
.169
.193
.020
.004
.007
2
1
0
0
0
INCHES
L
NOM
D
.026
.035
.004
.173
.197
.024
.006
.010
.251
14
5
5
4
A1
MAX
A
.043
.037
.006
.256
.177
.028
.008
.012
.201
10
10
8
MIN
0.85
0.05
6.25
4.30
4.90
0.50
0.09
0.19
0
0
0
MILLIMETERS*
© 2005 Microchip Technology Inc.
NOM
0.65
0.90
0.10
6.38
4.40
5.00
0.60
0.15
0.25
14
4
5
5
A2
MAX
1.10
0.95
0.15
6.50
4.50
5.10
0.70
0.20
0.30
10
10
8