PIC12F635-I/P Microchip Technology, PIC12F635-I/P Datasheet - Page 152

• Manufacturer Part Number: PIC12F635-I/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F635/PIC16F636/639
15.2
DS41232B-page 150
DC CHARACTERISTICS
D010
D011
D012
D013
D014
D015
D016
D017
D018
Legend: TBD = To Be Determined
Note 1:
Param
No.
2:
3:
4:
† Data in ‘Typ’ column is at 5.0V, 25 C unless otherwise stated. These parameters are for design guidance
DC Characteristics: PIC12F635/PIC16F636-I (Industrial)
I
DD
only and are not tested.
The test conditions for all I
wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
Front-End not included.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption. MCU only, Analog Front-End not included.
The peripheral current is the sum of the base I
peripheral is enabled. The peripheral
current from this limit. Max values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
Sym
Supply Current
Device Characteristics
(1,2)
DD
measurements in Active Operation mode are: OSC1 = external square
Preliminary
current can be determined by subtracting the base I
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
DD
or I
Typ†
TBD
TBD
TBD
190
330
220
370
600
140
260
180
320
580
340
500
800
180
320
580
110
2.1
2.4
18
35
70
9
PD
DD
and the additional current consumed when this
; MCLR = V
Max
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Units
mA
mA
mA
DD
-40°C
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
; WDT disabled. MCU only, Analog
V
© 2005 Microchip Technology Inc.
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
4.5
5.0
T
DD
A
+85°C for industrial
F
LP Oscillator mode
F
XT Oscillator mode
F
XT Oscillator mode
F
EC Oscillator mode
F
EC Oscillator mode
F
LFINTOSC mode
F
HFINTOSC mode
F
EXTRC mode
F
HS Oscillator mode
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
Conditions
= 32.768 kHz
= 1 MHz
= 4 MHz
= 1 MHz
= 4 MHz
= 31 kHz
= 4 MHz
= 4 MHz
= 20 MHz
DD
Note
DD
or I
.
PD