PIC12F635-I/P Microchip Technology, PIC12F635-I/P Datasheet - Page 164

• Manufacturer Part Number: PIC12F635-I/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F635/PIC16F636/639
15.10 AC Characteristics: PIC12F635/PIC16F636/639 (Industrial, Extended)
FIGURE 15-4:
TABLE 15-1:
DS41232B-page 162
1
2
3
4
Note 1:
Param
No.
CLKOUT
OSC1
*
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
F
T
T
TosL,
TosH
TosR,
TosF
OSC
CY
Sym
OSC
These parameters are characterized but not tested.
only and are not tested.
Instruction cycle period (T
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at ‘min’
values with an external clock applied to OSC1 pin. When an external clock input is used, the ‘max’ cycle
time limit is ‘DC’ (no clock) for all devices.
External CLKIN Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External CLKIN (OSC1) High
External CLKIN Low
External CLKIN Rise
External CLKIN Fall
EXTERNAL CLOCK TIMING REQUIREMENTS
EXTERNAL CLOCK TIMING
Q4
Characteristic
(1)
CY
(1)
(1)
) equals four times the input oscillator time base period. All specified values
Q1
(1)
1
(1)
100*
Min
250
250
250
200
20*
DC
DC
DC
DC
DC
0.1
27
50
50
27
50
—
—
—
—
—
2*
5
1
Preliminary
Q2
Typ†
125
T
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
CY
2
10,000
1,000
Max
200
50*
25*
15*
DC
3
37
20
20
37
20
—
—
—
—
—
—
—
—
—
—
4
4
4
Q3
Units
MHz XT Oscillator mode
MHz HS Oscillator mode
MHz EC Oscillator mode
MHz HFINTOSC Oscillator mode
MHz RC Oscillator mode
MHz XT Oscillator mode
MHz HS Oscillator mode
3
kHz
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
s
LP Oscillator mode
LP Oscillator mode
LP Oscillator mode
HS Oscillator mode
EC Oscillator mode
XT Oscillator mode
LP Oscillator mode
INTOSC Oscillator mode
RC Oscillator mode
XT Oscillator mode
HS Oscillator mode
T
LP oscillator, T
HS oscillator, T
XT oscillator, T
LP oscillator
XT oscillator
HS oscillator
CY
Q4
4
= 4/F
© 2005 Microchip Technology Inc.
OSC
4
Conditions
OSC
OSC
OSC
Q1
L/H duty cycle
L/H duty cycle
L/H duty cycle