ECJ-2F60J226M Panasonic - ECG, ECJ-2F60J226M Datasheet - Page 6

• Manufacturer Part Number: ECJ-2F60J226M
• Description: CAP CERAMIC 22UF 6.3V 0805 X6S
• Manufacturer: Panasonic - ECG
• Series: ECJr

Specifications of ECJ-2F60J226M

• Capacitance: 22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X6S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 105°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: ECJ2F60J226M; PCC2477TR

CLASSIFICATION
SUBJECT
Note ;
No
10
12
11
9
Bending
Strength
Vibration
Proof
Resis-
tance
Solder
Heat
Solderability
High Capacitance (P/N : ECJ2F60J226M) Common Specification
Contents
to
Appear-
ance
Capaci-
tance
Appear-
ance
Capaci-
tance
tan δ
Appear-
ance
Capaci-
tance
tan δ
I.R.
With-stand
voltage
Multilayer Ceramic Chip Capacitors (EIA 0805)
There shall be no cracks and other
mechanical damage.
There shall be no cracks and other
mechanical damage.
Shall be within the specified tolerance.
Shall meet the specified initial value.
There shall be no cracks and other
mechanical damage.
Shall meet the specified initial value.
Shall meet the specified initial value.
There shall be no dielectric break-
down or damage.
More than 95% of the soldered area
of both terminal electrodes shall be
covered with fresh solder.
Temp.
Temp.
Char.
Char.
X6S
X6S
SPECIFICATION
Change from the value
Change from the value
Within +/- 12.5 %
Within +/- 7.5 %
before test.
before test.
Performance
(continue)
Table 2
After soldering capacitor on the substrate 1
mm of bending shall be applied for 5 seconds.
Bending speed : 1mm/s
(shown in Fig. 3)
Solder the specimen to the testing jig shown
in Fig. 2. Apply a variable vibration of 1.5 mm
total amplitude in the 10 to 55 to10Hz vibration
frequency range swept in 1 min. in 3 mutually
perpendicular directions for 2 hours each, a
total of 6 hours.
Solder both method
Use solder H63A(JIS-Z-3282).For the flux,
use rosin (JIS-K-5902) ethanol solution of a
concentration of about 25% by weight. Use
tweezers for the holder to dip the specimen.
Solder temperature : 230+/-5 °C
Dipping period : 4+/-1 s
Dip the specimen in solder so that both
terminal electrodes are completely submerged.
Use solder H63A(JIS-Z-3282). For the flux use
rosin (JIS-K-5902) of ethanol solution of a
concentration of about 25 % by weight.
Use tweezers for the holder to dip the
specimen.
Preconditioning : Heat Temperature
Solder temperature : 270+/-5 °C
Dipping period : 3+/-0.5 s
Preheat condition :
Recovery : 48+/-4 hours
Order
1
2
150 to 200
Temp.(°C)
80 to 100
Test Method
(See 5.1.1)/Class2
No.
PAGE
DATE
120 to 180
120 to 180
Period(s)
151S-ECJ-KGS39E
Aug 28, 2008
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