ECJ-2F60J226M Panasonic - ECG, ECJ-2F60J226M Datasheet

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N:ECJ2F60J226M) Individual Specification 1. Scope This specification applies to High Capacitance Multilayer Ceramic Chip Capacitors (EIA 0805), Temp. Char:X6S, Rated voltage DC6 Nominal Capacitance 22 µF. 2. Style and Dimensions Operating Temperature Range / Storage Temperature Range ...

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... Panasonic Electronic Devices (Tianjin) Co., Ltd. (PEDTJ) 2. Scope 2- 1.This specification applies to High Capacitance Multilayer Ceramic Chip Capacitors (P/N : ECJ2F60J226M). If there is a difference between this common specification and any individual specifications, priority shall be given to the individual specifications. 2- 2.This product shall be used for general-purpose electronic equipment such as audiovisual, household, office, informa- tion & ...

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N : ECJ2F60J226M) Common Specification 3- 3.Nominal Capacitance (6) The Nominal Capacitance value is expressed in pico farads(pF) and is identified by a three-digit number ; the first two digit represent significant figures and the last digit specifies the number of zero to follow ...

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N : ECJ2F60J226M) Common Specification No Contents 1 Appearance There shall be no defects which affect the life and use. 2 Dimensions Shown in Individual Specification. 3 Dielectric Withstand- There shall be no dielectric break- ing voltage down or damage. ...

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N : ECJ2F60J226M) Common Specification No Contents 9 Bending Appear- There shall be no cracks and other Strength ance mechanical damage. Capaci- Temp. tance Char. X6S Appear- 10 Vibration There shall be no cracks and other ance Proof mechanical damage ...

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N : ECJ2F60J226M) Common Specification No Contents 13 Temperature Appear- There shall be no cracks and other cycle ance mechanical damage. Capaci- Temp. tance Char. X6S tan δ Shall meet the specified initial value. I.R. ...

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N : ECJ2F60J226M) Common Specification No Contents 16 High Tem- Appear- There shall be no cracks and other perature Re- ance mechanical damage. sistant Capaci- Temp. Loading tance Char. X6S tan δ 0.25 max. I.R. 10/C MΩ min. ...

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... CLASSIFICATION SUBJECT Multilayer Ceramic Chip Capacitors (EIA 0805) High Capacitance (P/N : ECJ2F60J226M) Common Specification Material : Glass epoxy board Thickness : 1.6 mm :Copper foil (0.035 mm thick) :Solder resist Material : Glass epoxy board Thickness : 1.6 mm :Copper foil (0.035 mm thick) :Solder resist Note ; SPECIFICATION Fig. 2 ...

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... Accordingly, when the Capacitors are used for circuits with narrow capacitance allowable range such as time constant circuits, we recommend to apply lower voltage upon due consideration on capacitance aging in addition to the above. Note ; Panasonic Electronic Devices Co., Ltd. SPECIFICATIONS No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 APPROVAL CHECK DESIGN T ...

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... Capacitor’s reliabilities against “Temperature Cycles” and “Heat shock” because of difference in thermal expansion coefficient between them. It shall be carefully confirmed that the actual board applied does not deteriorate the characteristics of the Capacitors. Note ; SPECIFICATIONS DC voltage (V) Before and After Heat treatment Heat treatment Time (h) No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 ...

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... 0.6 0504 1.37 1.0 2 Array 0.8 Recommended Amount of Solder (b) Proper amount of solder ← solder ← solder ↑ PC No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 0.3 0.2 to 0.3 0.25 to0.30 0.5 0.4 to 0.5 0.4 to 0.5 0.8 0.8 to 1.0 0.6 to 0.8 0.8 to 1.2 ...

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... Sectional view Chassis Solder (ground solder) Sectional view Lead wire of Retrofitted component Sectional view Portion to be excessively soldered Perforation No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 Improved applications by pattern division Solder resist Sectional view Solder resist Sectional view Solder resist Sectional view Solder resist ...

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... The PC board shall be supported by means of adequate supporting pins. Single surface mounting Double surface mounting Note ; SPECIFICATIONS Prohibited mounting Crack Separation Crack of solder No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 Recommended mounting The supporting pin must not Supporting be necessarily positioned . pin beneath the capacitor Supporting ...

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... Preheating temp. to Peak temp. 220 ℃ min. 260 ℃ max. Peak temp. to 140 ℃ ④Peak ②Temp. rise ⑤Gradual cooling ③Heating Time 60 s max. No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 Period or Speed 60 to 120 ℃/ max max ℃/s 〈 Allowable temperature difference ∆T〉 ...

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... The halogen substance in the residue of the soldering flux on the surface of the Capacitors may change resistance values. Note ; SPECIFICATIONS Soldering Gradual cooling 3 s max . 0201 to 0805, 0508, 0504 270 °C max. No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 〈Allowable temperature difference ∆T〉 Size Temp. Tol. 0201 to 1206 ∆T≦ 150 °C 0508, 0612, 0504 ∆ ...

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... Note ; SPECIFICATIONS : 20 W/L max kHz max. Prohibited setting Check pin Separated Prohibited dividing Load direction Load position PC board Chip component V-groove No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 Recommended setting Check pin Supporting pin Bending Torsion Recommended dividing Load direction V-groove ...

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... The Technical Report EIAJ RCR-2335 Caution Guide Line for Operation of Fixed Multilayer Ceramic Capacitors for Electronic Equipment by Japan Electronics and Information Technology Industries Association (March 2002 issued) Please refer to above technical report for details. Note ; SPECIFICATIONS No. 151S-ECJ-SS018E PAGE DATE Apr. 1, 2008 Crack Floor ...

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... Embossed Tape 4mm Paper Tape 4mm (Punch Carrier Tape) 4mm 4mm 4mm Embossed Tape 4mm 4mm 8mm B 1C 104 K No. 151S-ECJ-SV045E PAGE DATE Sep. 13, 2006 Quantity (pcs./reel) φ φ 180mm Reel 330mm Reel Packaging Quantity Quantity Code Code E 15000 --- ...

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... Note ; SPECIFICATIONS Punch Carrier Tape Press Carrier Tape (paper) Polystyrene reel (mixed with antistatic agent) 100mm min. 400mm min. No. 151S-ECJ-SV045E PAGE DATE Sep. 13, 2006 Top cover tape (thickness : 0.1mm max.) (antistatic finished polyester) Punch Carrier Tape (paper) Bottom tape Bottom tape (thickness : 0 ...

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... Fig. 6 Carrier Tape Dimension (a) Size 0201 : 2mm pitch for Paper tape (Press Carrier Tape Size Code A 0.36 +/- 0.03 B 0.66 +/- 0.03 Note ; SPECIFICATIONS 0201 No. 151S-ECJ-SV045E PAGE DATE Sep. 13, 2006 Punch Carrier Tape Code Dimension W 8.0 ± 0.2 F 3.50 ± 0.05 E 1.75 ± 0.10 P 2.00 ± ...

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... Size 0603, 0805 and 1206 : 4mm pitch for Paper tape (Punch Carrier Tape Size 0603 Code A 1.05 +/- 0.10 B 1.85 +/- 0.10 Note ; SPECIFICATIONS ) 0805 1206 1.65 +/- 0.20 2.0 +/- 0.2 2.4 +/- 0.2 3.6 +/- 0.2 No. 151S-ECJ-SV045E PAGE DATE Sep. 13, 2006 Code Dimension W 8.0 +/- 0.2 F 3.50 +/- 0.05 E 1.75 +/- 0.10 P 2.00 +/- 0. 2.00 +/- 0.05 ...

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... Size: 1812 : 8mm pitch for Embossed tape Size 1812 Code A 3.6 +/- 0.3 B 4.9 +/- 0.3 Note ; SPECIFICATIONS 1206 1210 1.9 +/- 0.2 2.8 +/- 0.2 3.5 +/- 0.2 3.5 +/- 0.2 No. 151S-ECJ-SV045E PAGE DATE Sep. 13, 2006 Code Dimension W 8.0 +/- 0.2 F 3.50 +/- 0.05 E 1.75 +/- 0.10 P 4.0 +/- 0 2.00 +/- 0.05 ...

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... CLASSFICATION SUBJECT Multilayer Ceramic Chip Capacitor (Size:0201 to 1812) Packaging Specifications Fig. 7 Reel Dimension φ (a) 180mm Reel (Standard Reel) φ (b) 330mm Reel (Large size Reel) Note ; SPECIFICATIONS No. 151S-ECJ-SV045E PAGE DATE Sep. 13, 2006 Code Dimension φ A 180+0/-3.0 φ +/- 0.5 C 13.0 +/- 0.5 D 21.0 +/- 0 ...