ECJ-2F60J226M Panasonic - ECG, ECJ-2F60J226M Datasheet - Page 12

• Manufacturer Part Number: ECJ-2F60J226M
• Description: CAP CERAMIC 22UF 6.3V 0805 X6S
• Manufacturer: Panasonic - ECG
• Series: ECJr

Specifications of ECJ-2F60J226M

• Capacitance: 22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X6S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 105°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: ECJ2F60J226M; PCC2477TR

CLASSIFICATION
SUBJECT
Note ;
2-2-2. Design of Land Pattern
{ Recommended land dimensions (Ex.) }
Land
2 Array type
4 Array type
Land
(1) Recommended land dimensions are shown below for proper amount of solder to prevent cracking at the
[ For High Capacitance, General Electronic Equipment, Low ProfileType, 100V･200V series,
[ Wide-width Type ]
[ Array Type ]
(2) The size of lands shall be designed to be equal between the right and left sides. If the amount of solder on
630V series, High-Q Capacitors ]
time of excessive stress to the Capacitors due to increased amount of solder.
the right land is different from that on the left land, the component may be cracked by stress to one side of
the component since the side with a larger amount of solder solidifies later at the time of cooling.
b
SMD
b
c
SMD
c
SMD
a
a
Common Specification ( Precautions for Use)
(a) Excessive amount
P
P/2 P
Multilayer Ceramic Chip Capacitor
↑
PC
of solder
Solder
resist
Land
Solder
resist
SMD
Land
SPECIFICATIONS
← solder
4 Array
4 Array
2 Array
(EIA)
0805
1206
(EIA)
Size
0504
Recommended Amount of Solder
Size
(EIA)
(EIA)
0201
0402
0603
0805
1206
1210
0508
0612
Size
Size
(b) Proper amount
Component Dimension
↑
PC
2.0
3.2
1.37
L
0.6
1.0
1.6
2.0
3.2
3.2
L
Component Dimension
1.25
Component Dimension
of solder
L
1.6
Ｌ
Component
Dimension
1.25
1.25
1.6
0.3
0.5
0.8
1.6
2.5
1.0
W
W
W
2.0
3.2
← solder
Ｗ
0.6 to 1.25
0.6 to 1.6
0.8 to 2.5
0.85
0.85
0.6
0.8
T
T
0.3
0.5
0.8
0.85
0.85
T
Ｔ
(c)Insufficient amount
to 0.75
to 0.4
to 0.6
to 1.1
0.55
↑
PC
0.3
0.3
0.9
a
a
of solder
0.2 to 0.3
0.4 to 0.5
0.8 to 1.0
0.8 to 1.2
1.8 to 2.2
1.8 to 2.2
0.5 to 0.7
0.8 to 1.0
a
ａ
to 0.55
to 0.7
to 0.6
to 0.9
0.45
←solder
0.4
0.5
0.7
b
b
0.25 to0.30
0.4 to 0.5
0.6 to 0.8
0.8 to 1.0
1.0 to 1.2
1.0 to 1.2
0.5 to 0.6
0.6 to 0.7
No.
PAGE
DATE
to 0.45
b
ｂ
to 0.56
to 0.3
151S-ECJ-SS018E
to 0.4
0.35
0.46
0.2
0.3
c
c
Apr. 1, 2008
Unit in mm
3 of 9
Unit in mm
Unit in mm
1.4 to 1.9
2.5 to 3.0
Unit in mm
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
0.8 to 1.0
1.0 to 1.3
1.8 to 2.3
to 0.6
to 0.9
to 0.91
to 0.74
0.4
0.7
0.54
0.71
ｃ
c
P
P