ECJ-2F60J226M Panasonic - ECG, ECJ-2F60J226M Datasheet - Page 13

• Manufacturer Part Number: ECJ-2F60J226M
• Description: CAP CERAMIC 22UF 6.3V 0805 X6S
• Manufacturer: Panasonic - ECG
• Series: ECJr

Specifications of ECJ-2F60J226M

• Capacitance: 22µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X6S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 105°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: ECJ2F60J226M; PCC2477TR

CLASSIFICATION
SUBJECT
Note ;
2-2-3. Utilization of Solder Resist
2-2-4. Component Layout
Mixed mounting
with a component with
lead wires
Arrangement
near chassis
Retrofitting of
Component with lead
wires
Lateral arrangement
Warp of
Circuit board
The application of solder resist is effective in preventing solder bridges and controlling the amount of solder on
PC boards.
The Capacitors / components shall be placed on the PC board such that both electrodes are subjected to
uniform stresses, or to position the component electrodes at right angles to the grid glove or bending line. This
should be done to avoid cracking the Capacitors from bending the PC board after or during placing/mounting on
the PC board.
See the table below.
(1) To minimize mechanical stress caused by warp or bending of a PC board, please follow the recommended
(2) The following drawing is for your reference since
(3) The magnitude of mechanical stress applied to
Capacitor layout below.
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Capacitors.
the Capacitors when the circuit board is divided is
in the order of push back < slit < V-groove <
perforation.
Also take into account the layout of the
Capacitors and the dividing/breaking method.
(1)Solder resist shall be utilized to equalize the amounts of solder on both sides.
(2)Solder resist shall be used to divide the pattern for the following cases;
･Components are arranged closely.
･The Capacitor is mounted near a component with lead wires.
･The Capacitor is placed near a chassis.
Common Specification ( Precautions for Use)
Multilayer Ceramic Chip Capacitor
Prohibited layout
Soldering iron
Land
Prohibited Applications and Recommended Applications
Chassis
SPECIFICATIONS
Solder (ground solder)
Prohibited applications
The lead wire of
a component with
Portion to be
Lead wire of
excessively
Sectional view
Sectional view
Sectional view
Retrofitted
component
lead wires
soldered
Perforation
Recommended layout
Improved applications by pattern division
Magnitude of stress A＞B＝C＞D＞E
Solder resist
Solder resist
Solder resist
A
E
Lay out the Capacitor
Slit
sideways against the
C
stressing direction
No.
PAGE
DATE
151S-ECJ-SS018E
Sectional view
Solder resist
D
Sectional view
Sectional view
Apr. 1, 2008
B
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