TMPSNS-RTD1 Microchip Technology, TMPSNS-RTD1 Datasheet - Page 26

• Manufacturer Part Number: TMPSNS-RTD1
• Description: BOARD EVAL PT100 RTD TEMP SENSOR
• Manufacturer: Microchip Technology

Specifications of TMPSNS-RTD1

• Sensor Type: Temperature
• Interface: USB
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: MCP3301, MCP6S26, PIC18F2550
• Processor To Be Evaluated: MCP6S26, MCP3301, MCP6024, MCP41010, PIC18F2550, TC1071, MCP6002
• Data Bus Width: 12 bit
• Interface Type: USB
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• Voltage - Supply: -
• Sensitivity: -
• Sensing Range: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

MCP3301
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21700C-page 26
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
φ
A2
A1
E1
L1
N
A
E
D
e
h
L
φ
c
b
α
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
0°
5°
5°
–
MILLMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c