MT8VDDT6464HDG-335F2 Micron Technology Inc, MT8VDDT6464HDG-335F2 Datasheet - Page 4

• Manufacturer Part Number: MT8VDDT6464HDG-335F2
• Description: MODULE DDR 512MB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT8VDDT6464HDG-335F2

• Memory Type: DDR SDRAM
• Memory Size: 512MB
• Speed: 333MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 64Mx64
• Total Density: 512MByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 800mA
• Number Of Elements: 8
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 5:
Pin numbers may not correlate with symbols; refer to Pin Assignment Tables on pages 3
pdf: 09005aef80b575ca, source: 09005aef806e1d28
DDA8C32_64x64HDG.fm - Rev. D 9/04 EN
106, 107, 108, 109, 110,
11, 25, 47, 61, 133, 147,
12, 26, 48, 62, 134, 148,
35, 37, 89, 92, 158, 160
99, 100, 101, 102, 105,
PIN NUMBERS
118, 119, 120
111, 112, 115
121, 122
116, 117
169, 183
170, 184
95, 96
Pin Descriptions
WE#, CAS#, RAS#
DQS0–DQS7
CKE0, CKE1
CK0, CK0#,
CK1, CK1#,
CK2, CK2#,
DM0–DM7
SYMBOL
BA0, BA1
S0#, S1#
A0–A12
Output
Input/
TYPE
Input Command Inputs: RAS#, CAS#, and WE# (along with S#)
Input Clock: CK, CK# are differential clock inputs. All address and
Input Clock Enable: CKE HIGH activates and CKE LOW deactivates
Input Chip Selects: S# enables (registered LOW) and disables
Input Bank Address: BA0 and BA1 define to which device bank an
Input Address Inputs: Provide the row address for ACTIVE
Input Data Write Mask. DM LOW allows WRITE operation. DM HIGH
4
define the command being entered.
control input signals are sampled on the crossing of the
positive edge of CK,and negative edge of CK#. Output data
(DQs and DQS) is referenced to the crossings of CK and CK#.
the internal clock, input buffers and output drivers. Taking
CKE LOW provides PRECHARGE POWER-DOWN and SELF
REFRESH operations (all device banks idle), or ACTIVE POWER-
DOWN (row ACTIVE in any device bank). CKE is synchronous
for POWER-DOWN entry and exit, and for SELF REFRESH
entry. CKE is asynchronous for SELF REFRESH exit and for
disabling the outputs. CKE must be maintained HIGH
throughout read and write accesses. Input buffers (excluding
CK, CK# and CKE) are disabled during POWER-DOWN. Input
buffers (excluding CKE) are disabled during SELF REFRESH.
CKE is an SSTL_2 input but will detect an LVCMOS LOW level
after V
CKE is brought HIGH, it becomes an SSTL_2 input only.
(registered HIGH) the command decoder. All commands are
masked when S# is registered HIGH. S# is considered part of
the command code.
ACTIVE, READ, WRITE, or PRECHARGE command is being
applied.
commands, and the column address and auto precharge bit
(A10) for READ/WRITE commands, to select one location out
of the memory array in the respective device bank. A10
sampled during a PRECHARGE command determines whether
the PRECHARGE applies to one device bank (A10 LOW, device
bank selected by BA0, BA1) or all device banks (A10 HIGH).
The address inputs also provide the op-code during a MODE
REGISTER SET command. BA0 and BA1 define which mode
register (mode register or extended mode register) is loaded
during the LOAD MODE REGISTER command.
Data Strobe: Output with READ data, input with WRITE data.
DQS is edge-aligned with READ data, centered in WRITE data.
Used to capture data.
blocks WRITE operation. DM lines do not affect READ
operation.
256MB, 512MB (x64, DR) PC3200
DD
Micron Technology, Inc., reserves the right to change products or specifications without notice.
is applied and until CKE is first brought HIGH. After
200-PIN DDR SODIMM
DESCRIPTION
©2004 Micron Technology, Inc.